⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1485852 | 0.97 | TSHR (0.36) | — | |
| SCHEMBL1485937 | 0.97 | — | — | |
| SCHEMBL24102699 | 0.93 | — | — | |
| Hydrochloric Acid SCHEMBL23748166 | 0.90 | — | — | |
| SCHEMBL3626660 | 0.86 | — | — | |
| Hydrochloric Acid SCHEMBL1949433 | 0.83 | — | — | |
| SCHEMBL24791704 | 0.73 | — | — | |
| SCHEMBL10621331 | 0.73 | — | — | |
| SCHEMBL14748122 | 0.73 | — | — | |
| SCHEMBL28860757 | 0.69 | TSHR (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 43 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2021150022-A1 | SUBSTRATE SURFACE-MODIFIED WITH VINYL AMINO NON-AROMATIC CYCLIC COMPOUND AND METHOD FOR SURFACE-MODIFYING SAME | 하이드로메이트 코팅스, 인크. | 2021-07-29 | — | — | WO | claimed |
| US-20250066570-A1 | LAMINATE DEVICE WITH METALLIC AND POLYMER LAYERS | QUANTUM MICROMATERIALS INC (US) | 2025-02-27 | — | — | US | disclosed |
| US-12077646-B2 | Coating substrate by polymerization of amine compound and apparatus having polymer coated substrate | Quantum MicroMaterials, Inc. (US) | 2024-09-03 | — | — | US | disclosed |
| US-20240209231-A1 | AIRTIGHT FILM WITH CERAMIC SEALING LAYER AND POLYMER SEALING LAYER | Quantum MicroMaterials, Inc. | 2024-06-27 | — | — | US | disclosed |
| WO-2024135498-A1 | RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, AND COMPOUND | 東京応化工業株式会社 | 2024-06-27 | — | — | WO | disclosed |
| EP-4282907-A1 | COATING SUBSTRATE BY POLYMERIZATION OF AMINE COMPOUND, AND APPARATUS HAVING POLYMER COATED SUBSTRATE | Quantum Micromaterials, Inc. (US) | 2023-11-29 | — | — | EP | disclosed |
| US-20230357578-A1 | AIRTIGHT FILM WITH CERAMIC SEALING LAYER AND POLYMER SEALING LAYER | Quantum MicroMaterials, Inc. | 2023-11-09 | — | — | US | disclosed |
| WO-2023195407-A1 | RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN | 東京応化工業株式会社 | 2023-10-12 | — | — | WO | disclosed |
| CN-116848180-A | Apparatus for coating a substrate by polymerization of an amine compound and a substrate having a polymer coating | 量子微材料有限公司 | 2023-10-03 | — | — | CN | disclosed |
| WO-2023176546-A1 | RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, COMPOUND, AND ACID GENERATOR | 東京応化工業株式会社 | 2023-09-21 | — | — | WO | disclosed |
| EP-2301750-B1 | Resin composition for laser engraving, relief printing starting plate for laser engraving and process for producing the same | FUJIFILM CORP (JP) | 2012-10-31 | — | — | EP | disclosed |
| CN-102540712-A | Resin composition for laser engraving, relief printing plate precursor for laser engraving and process for producing the same, and relief printing plate and process for making the same | FUJIFILM CORP | 2012-07-04 | — | — | CN | disclosed |
| CN-102540713-A | Resin composition for laser engraving, relief printing plate precursor for laser engraving and process for producing same, and process for making relief printing plate | FUJIFILM CORP | 2012-07-04 | — | — | CN | disclosed |
| US-20120146264-A1 | RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, AND PROCESS FOR MAKING RELIEF PRINTING PLATE | FUJIFILM CORPORATION (JP) | 2012-06-14 | — | — | US | disclosed |
| US-20120135196-A1 | RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING THE SAME, AND RELIEF PRINTING PLATE AND PROCESS FOR MAKING THE SAME | FUJIFILM CORPORATION (JP) | 2012-05-31 | — | — | US | disclosed |
| CN-102300719-A | Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate and method for producing relief printing plate | — | 2011-12-28 | — | — | CN | disclosed |
| US-20110076454-A1 | RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING STARTING PLATE FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, AND RELIEF PRINTING PLATE AND PROCESS FOR MAKING SAME | FUJIFILM CORPORATION (JP) | 2011-03-31 | — | — | US | disclosed |
| EP-2301750-A1 | Resin composition for laser engraving, relief printing starting plate for laser engraving and process for producing the same | Fujifilm Corporation (JP) | 2011-03-30 | — | — | EP | disclosed |
| WO-2010090345-A1 | RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCING RELIEF PRINTING PLATE | FUJIFILM CORPORATION (JP) | 2010-08-12 | — | — | WO | disclosed |
| EP-0206621-A1 | Process for disproportionating silanes | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1986-12-30 | — | — | EP | disclosed |