SCHEMBL1485907

SCHEMBL1485907

NC1(c2ccccc2)CCCCCCC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7095956 1.00
SCHEMBL7741012 1.00
SCHEMBL20104825 1.00
SCHEMBL43248 1.00
Hydrochloric Acid SCHEMBL7002319 0.98
Hydrochloric Acid SCHEMBL18662816 0.98
SCHEMBL42115 0.97
Hydrochloric Acid SCHEMBL7307173 0.95
SCHEMBL1492690 0.92
Hydrochloric Acid SCHEMBL1492697 0.90

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2738010-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR PRODUCING RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR PRODUCING RELIEF PRINTING PLATE, AND RELIEF PRINTING PLATE FUJIFILM Corporation (JP) 2014-06-04 EP disclosed
US-20140130693-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR PRODUCING RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, PROCESS FOR MAKING RELIEF PRINTING PLATE, AND RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2014-05-15 US disclosed
EP-2393666-B1 RELIEF PRINTING PLATE FUJIFILM CORP (JP) 2014-01-15 EP disclosed
US-8618208-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving and process for producing the same, and relief printing plate and process for making the same FUJIFILM CORPORATION (JP) 2013-12-31 US disclosed
US-8541534-B2 Resin composition for laser engraving, relief printing plate precursor for laser engraving, relief printing plate and method for producing relief printing plate FUJIFILM CORPORATION (JP) 2013-09-24 US disclosed
EP-2565046-A2 Resin composition for laser engraving, relief printing plate precursor for laser engraving and process for producing same, process for making relief printing plate, and relief printing plate Fujifilm Corporation (JP) 2013-03-06 EP disclosed
US-20130047878-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, PROCESS FOR MAKING RELIEF PRINTING PLATE, AND RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2013-02-28 US disclosed
EP-2301750-B1 Resin composition for laser engraving, relief printing starting plate for laser engraving and process for producing the same FUJIFILM CORP (JP) 2012-10-31 EP disclosed
US-20120146264-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, AND PROCESS FOR MAKING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2012-06-14 US disclosed
US-20120135196-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING THE SAME, AND RELIEF PRINTING PLATE AND PROCESS FOR MAKING THE SAME FUJIFILM CORPORATION (JP) 2012-05-31 US disclosed
US-20110076454-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING STARTING PLATE FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, AND RELIEF PRINTING PLATE AND PROCESS FOR MAKING SAME FUJIFILM CORPORATION (JP) 2011-03-31 US disclosed
EP-2301750-A1 Resin composition for laser engraving, relief printing starting plate for laser engraving and process for producing the same Fujifilm Corporation (JP) 2011-03-30 EP disclosed
WO-2010090345-A1 RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING, RELIEF PRINTING PLATE AND METHOD FOR PRODUCING RELIEF PRINTING PLATE FUJIFILM CORPORATION (JP) 2010-08-12 WO disclosed
US-20030109549-A1 2-Substituted-1-piperidyl benzimidazole compounds as ORL1-receptor agonists ITO FUMITAKA (JP) 2003-06-12 US disclosed
EP-1102762-B1 2-SUBSTITUTED-1-PIPERIDYL BENZIMIDAZOLE COMPOUNDS AS ORL1-RECEPTOR AGONISTS PFIZER (US) 2002-11-13 EP disclosed
EP-1102762-A2 2-SUBSTITUTED-1-PIPERIDYL BENZIMIDAZOLE COMPOUNDS AS ORL1-RECEPTOR AGONISTS PFIZER INC. (US) 2001-05-30 EP disclosed
US-6172067-B1 ANALGESICS, ANTIINFLAMMATORY AGENTS PFIZER INC. 2001-01-09 US disclosed
WO-2000008013-A2 2-SUBSTITUTED-1-PIPERIDYL BENZIMIDAZOLE COMPOUNDS AS ORL1-RECEPTOR AGONISTS PFIZER PHARMACEUTICALS INC. (JP) 2000-02-17 WO disclosed
EP-0206621-B1 PROCESS FOR DISPROPORTIONATING SILANES MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-11-15 EP disclosed