SCHEMBL14866825

SCHEMBL14866825

CCC(C)COCc1ccc(-c2ccccc2)cc1

nearest known ligand 0.47

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
▸ IDO1 P14902 2/20 0.47
▸ AGXT P21549 2/20 0.47
▸ TSHR P16473 1/20 0.42
▸ CA1 P00915 4/20 0.41
▸ CA2 P00918 2/20 0.41
▸ CA7 P43166 2/20 0.41
▸ CA9 Q16790 2/20 0.41
▸ NAAA Q02083 2/20 0.41
▸ TACR1 P25103 2/20 0.40
▸ KMT2A Q03164 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13003073 0.89 TSHR (0.54) TSHRCA1CA2CA7CA9
SCHEMBL10052366 0.89 TSHR (0.54) TSHRCA1CA2CA7CA9
SCHEMBL2608877 0.84 IDO1 (0.52) IDO1AGXTTSHRCA1CA2
SCHEMBL14866839 0.80 AGXT (0.45) IDO1AGXTCA1CA2CA9
SCHEMBL19232139 0.80 HPGD (0.43) IDO1CA1CA2
SCHEMBL14453899 0.79 TSHR (0.61) TSHRCA1CA2CA7CA9
SCHEMBL13749320 0.79 CYP3A4 (0.44) IDO1
SCHEMBL6969891 0.79 FOLH1 (0.53) TSHR
SCHEMBL2614813 0.77 IDO1 (0.57) IDO1AGXTTSHRNAAA
SCHEMBL14866820 0.77 TACR1 (0.51) TACR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9034558-B2 Actinic-ray- or radiation-sensitive resin composition, actinic-ray- or radiation-sensitive film and method of forming pattern FUJIFILM CORPORATION (JP) 2015-05-19 — — US disclosed
US-20130115557-A1 ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY- OR RADIATION-SENSITIVE FILM AND METHOD OF FORMING PATTERN FUJIFILM CORPORATION (JP) 2013-05-09 — — US disclosed
US-20130095429-A1 ACTINIC-RAY- OR RADIATION-SENSITIVE RESIN COMPOSITION AND METHOD OF FORMING PATTERN USING THE SAME FUJIFILM CORPORATION (JP) 2013-04-18 — — US disclosed
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