SCHEMBL1493249

SCHEMBL1493249

CCOc1ccc(N=Nc2ccc(N(CC)CC)cc2)cc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 5/20 0.54
MAPT P10636 5/20 0.54
TDP1 Q9NUW8 5/20 0.54
MEN1 O00255 4/20 0.54
SMN1; SMN2 Q16637 3/20 0.54
NPC1 O15118 2/20 0.54
RAB9A P51151 2/20 0.54
KDM4E B2RXH2 2/20 0.54
LMNA P02545 2/20 0.54
ALDH1A1 P00352 6/20 0.50
NQO1 P15559 1/20 0.50
CYP1A2 P05177 1/20 0.50
GSK3B P49841 1/20 0.48
POLB P06746 1/20 0.48
ADRA2A P08913 2/20 0.47
GAA P10253 1/20 0.47
CRHBP P24387 1/20 0.46
HTT P42858 1/20 0.46
CRHR2 Q13324 1/20 0.46
SCN1A P35498 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1493247 1.00 KMT2A (0.54) KMT2AMAPTTDP1MEN1SMN1; SMN2
SCHEMBL9806020 0.89 NQO1 (0.64) KMT2AMAPTTDP1MEN1SMN1; SMN2
SCHEMBL12513604 0.86 MAPT (0.51) KMT2AMAPTTDP1MEN1SMN1; SMN2
SCHEMBL15489413 0.85 MAPT (0.53) KMT2AMAPTTDP1MEN1SMN1; SMN2
Methylamine SCHEMBL27794170 0.85 NQO1 (0.58) MAPTTDP1SMN1; SMN2KDM4ELMNA
SCHEMBL8762872 0.84 NQO1 (0.70) KMT2AMAPTTDP1MEN1SMN1; SMN2
SCHEMBL8762877 0.84 NQO1 (0.70) KMT2AMAPTTDP1MEN1SMN1; SMN2
SCHEMBL9176995 0.84 GSK3B (0.63) KMT2AMAPTTDP1MEN1SMN1; SMN2
SCHEMBL11311514 0.84 ALDH1A1 (0.55) KMT2AMAPTTDP1MEN1SMN1; SMN2
SCHEMBL9176989 0.84 GSK3B (0.63) KMT2AMAPTTDP1MEN1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 89 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6379859-B2 MIXTURE OF ALKALI SOLUBLE POLYMER AND PHOTOSENSITIZERS TOKYO OHKA KOGYO CO., LTD. (JP) 2002-04-30 US claimed
US-4287289-A Photoresist cyclized rubber and bisazide compositions containing a monoazo photoextinction agent TOKYO OHKA KOGYO KABUSHIKI KAISHA (JP) 1981-09-01 US claimed
US-4268603-A Photoresist compositions TOKYO OHKA KOGYO KABUSHIKI KAISHA (JP) 1981-05-19 US claimed
CN-118732397-A Positive photoresist composition and method for producing resist pattern 常州强力先端电子材料有限公司 2024-10-01 CN disclosed
CN-106933034-B Positive photoresist composition 东京应化工业株式会社 2023-01-06 CN disclosed
CN-114967342-A Positive photosensitive composition and dry film, patterned resist film, substrate with mold, and method for producing plated molded article 东京应化工业株式会社 2022-08-30 CN disclosed
CN-114967343-A Positive photosensitive composition and dry film, patterned resist film, substrate with mold, and method for producing plated molded article 东京应化工业株式会社 2022-08-30 CN disclosed
CN-107407879-B Photosensitive resin composition, photosensitive sheet, semiconductor device, and method for manufacturing semiconductor device 东丽株式会社 2020-10-16 CN disclosed
CN-106444289-B Ultraviolet irradiation apparatus, resist pattern forming apparatus, ultraviolet irradiation method, and resist pattern forming method 东京应化工业株式会社 2020-09-08 CN disclosed
US-10705425-B2 Photosensitive resin composition, photosensitive, sheet, semiconductor device and method for manufacturing semiconductor device TORAY INDUSTRIES, INC. (JP) 2020-07-07 US disclosed
CN-111285754-A Method for purifying cresols, method for producing phenol resin for photosensitive resin composition, and photosensitive resin composition 东京应化工业株式会社 2020-06-16 CN disclosed
EP-0902326-A2 Novolak resin precursor, novolak resin and positive photoresist composition containing the novolak resin TOKYO OHKA KOGYO CO., LTD. (JP) 1999-03-17 EP disclosed
US-5853948-A Positive photoresist compositions and multilayer resist materials using the same TOKYO OHKA KOGYO CO., LTD. (JP) 1998-12-29 US disclosed
US-5738968-A Positive photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1998-04-14 US disclosed
US-5702861-A BLEND OF ALKALI SOLUBLE RESIN, QUINONE DIAZIDE COMPOUND AND AN AROMATIC POLYHYDROXY COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 1997-12-30 US disclosed
US-5702862-A ALKALI SOLUBLE RESIN; A QUINONE DIAZIDE GROUP-CONTAINING COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 1997-12-30 US disclosed
US-4985333-A PHOTORESISTS FOR SEMICONDUCTORS TOKYO OHKA KOGYO CO., LTD. (JP) 1991-01-15 US disclosed
US-4882260-A Positive-working photosensitive quinone diazide composition with alkali insoluble dye and alkali soluble dye TOKYO OHKA KOGYO CO., LTD. (JP) 1989-11-21 US disclosed
US-4287289-A Photoresist cyclized rubber and bisazide compositions containing a monoazo photoextinction agent TOKYO OHKA KOGYO KABUSHIKI KAISHA (JP) 1981-09-01 US disclosed
US-4268603-A Photoresist compositions TOKYO OHKA KOGYO KABUSHIKI KAISHA (JP) 1981-05-19 US disclosed