⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6564139 | 0.75 | — | — | |
| SCHEMBL6564277 | 0.73 | — | — | |
| SCHEMBL8698339 | 0.72 | ELANE (0.30) | — | |
| SCHEMBL134560 | 0.69 | — | — | |
| SCHEMBL286322 | 0.69 | — | — | |
| SCHEMBL310725 | 0.69 | — | — | |
| SCHEMBL6562511 | 0.67 | — | — | |
| SCHEMBL30893950 | 0.67 | — | — | |
| SCHEMBL16693038 | 0.67 | — | — | |
| SCHEMBL1788916 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 210 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118325193-A | High-performance heat-conducting wave-absorbing material with high heat conduction and high voltage resistance, and preparation method and application thereof | 浙江三元电子科技有限公司 | 2024-07-12 | — | — | CN | claimed |
| CN-115820223-A | Thermally conductive silicone composition | 杜邦东丽特殊材料株式会社 | 2023-03-21 | — | — | CN | claimed |
| CN-109880377-B | Silica gel/carbonyl iron powder composite broadband wave absorbing plate and preparation method thereof | 浙江三元电子科技有限公司 | 2021-11-12 | — | — | CN | claimed |
| CN-109880377-A | A kind of silica gel/carbonyl iron dust compound broadband inhales wave plate and preparation method thereof | 浙江三元电子科技有限公司 | 2019-06-14 | — | — | CN | claimed |
| US-5912287-A | CURABLE MIXTURE OF UNSATURATED POLYSILOXANE, SILICA, PLATINUM COMPOUND AND ALKYNYLOXYSILANE; FIREPROOFING, DIELECTRICS, TRACKING RESISTANCE | DOW CORNING TORAY SILICONE CO., LTD. (JP) | 1999-06-15 | — | — | US | claimed |
| US-12637568-B2 | Curable hot-melt silicone composition, cured product thereof, and laminate including curable hot-melt silicone composition or cured product thereof | DOW TORAY CO., LTD. (JP) | 2026-05-26 | — | — | US | disclosed |
| EP-4711418-A1 | CURABLE SILICONE COMPOSITION, CURED OBJECT FORMED FROM SAME, AND METHOD FOR PRODUCING SAME | Dow Toray Co., Ltd. (JP) | 2026-03-18 | — | — | EP | disclosed |
| US-20260047467-A1 | CONDUCTIVE PILLAR MODULE PRECURSOR FOR MANUFACTURING SEMICONDUCTOR, CONDUCTIVE PILLAR MODULE FOR MANUFACTURING SEMICONDUCTOR, SEMICONDUCTOR OR SEMICONDUCTOR PRECURSOR, AND METHOD FOR MANUFACTURING SAME | DOW TORAY CO LTD (JP) | 2026-02-12 | — | — | US | disclosed |
| EP-4640766-A1 | HOT MELT CURABLE SILICONE COMPOSITION, LAYERED PRODUCT USING SAID COMPOSITION, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | Dow Toray Co., Ltd. (JP) | 2025-10-29 | — | — | EP | disclosed |
| EP-4640765-A1 | CURABLE SILICONE COMPOSITION, CURED PRODUCT OF SAME, AND USE OF SAID COMPOSITION | Dow Toray Co., Ltd. (JP) | 2025-10-29 | — | — | EP | disclosed |
| US-20250326950-A1 | SILSESQUIOXANE DERIVATIVE AND METHOD FOR PRODUCING SAME, CURABLE COMPOSITION, HARD COAT AGENT, CURED PRODUCT, HARD COAT, AND BASE MATERIAL | TOAGOSEI CO LTD (JP) | 2025-10-23 | — | — | US | disclosed |
| EP-4597552-A1 | CONDUCTIVE PILLAR MODULE PRECURSOR FOR MANUFACTURING SEMICONDUCTOR, CONDUCTIVE PILLAR MODULE FOR MANUFACTURING SEMICONDUCTOR, SEMICONDUCTOR OR SEMICONDUCTOR PRECURSOR, AND METHOD FOR MANUFACTURING SAME | Dow Toray Co., Ltd. (JP) | 2025-08-06 | — | — | EP | disclosed |
| US-20040132890-A1 | Low-specific-gravity liquid silicone rubber composition and an article made therefrom | OKA YUTAKA (JP) | 2004-07-08 | — | — | US | disclosed |
| EP-1423471-A1 | LOW-SPECIFIC-GRAVITY LIQUID SILICONE RUBBER COMPOSITION AND AN ARTICLE MOLDED THEREFROM | Dow Corning Toray Silicone Company, Ltd. (JP) | 2004-06-02 | — | — | EP | disclosed |
| US-6677407-B1 | LOW TEMPERATURE, QUICK SETTING SILICONE RELEASE AGENTS COMPRISING MIXTURES OF POLYSILOXANES, ORGANOSILICON COMPOUNDS, KARSTEDT CATALYSTS AND DILUENTS, USED AS ADHESIVE TAPES OR LABELS | DOW CORNING CORPORATION | 2004-01-13 | — | — | US | disclosed |
| EP-1004632-B1 | Silicone composition for forming cured release films | DOW CORNING TORAY SILICONE (JP) | 2003-12-10 | — | — | EP | disclosed |
| WO-2003020817-A1 | LOW-SPECIFIC-GRAVITY LIQUID SILICONE RUBBER COMPOSITION AND AN ARTICLE MOLDED THEREFROM | DOW CORNING TORAY SILICONE CO., LTD. (JP) | 2003-03-13 | — | — | WO | disclosed |
| US-5912287-A | CURABLE MIXTURE OF UNSATURATED POLYSILOXANE, SILICA, PLATINUM COMPOUND AND ALKYNYLOXYSILANE; FIREPROOFING, DIELECTRICS, TRACKING RESISTANCE | DOW CORNING TORAY SILICONE CO., LTD. (JP) | 1999-06-15 | — | — | US | disclosed |
| EP-0057835-B1 | SHAPED ARTICLES OF SYNTHETIC RESINS HAVING IMPROVED SURFACE PROPERTIES AND METHOD FOR MAKING SAME | Shin-Etsu Chemical Co., Ltd. (JP) | 1987-04-29 | — | — | EP | disclosed |
| EP-0057835-A1 | Shaped articles of synthetic resins having improved surface properties and method for making same | Shin-Etsu Chemical Co., Ltd. (JP) | 1982-08-18 | — | — | EP | disclosed |