SCHEMBL310725

SCHEMBL310725

C#CC(C)(C)OC([SiH3])(OC(C)(C)C#C)OC(C)(C)C#C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8698339 0.81 ELANE (0.30)
SCHEMBL23293756 0.73
SCHEMBL1498038 0.69
SCHEMBL134560 0.65
SCHEMBL3886300 0.63 ALDH1A1 (0.33)
SCHEMBL30893950 0.63
SCHEMBL4796430 0.63
SCHEMBL5546103 0.63
SCHEMBL1788916 0.63
SCHEMBL16693038 0.63

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 48 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116515300-B High oxygen permeability hard contact lens material and contact lens 上海艾康特医疗科技有限公司 2023-12-08 CN claimed
CN-116515300-A High oxygen permeability hard contact lens material and contact lens 上海艾康特医疗科技有限公司 2023-08-01 CN claimed
US-20260117028-A1 CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF DOW SILICONES CORP (US) 2026-04-30 US disclosed
US-12584044-B2 Release control agent, releasable film-forming silicone composition, and release liner DOW TORAY CO., LTD. (JP) 2026-03-24 US disclosed
US-20260042785-A1 BIS(ALKYNYLOXYSILYL)ALKANE, METHOD FOR PRODUCING SAME, AND CURABLE SILICONE COMPOSITION DOW TORAY CO LTD (JP) 2026-02-12 US disclosed
EP-4301814-B1 CURABLE SILICONE COMPOSITION DOW SILICONES CORP (US) 2025-12-24 EP disclosed
US-20250263581-A1 ACTIVE ENERGY RAY CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF DOW SILICONES CORP (US) 2025-08-21 US disclosed
US-20250223477-A1 CURABLE SILICONE COMPOSITION DOW TORAY CO LTD (JP) 2025-07-10 US disclosed
CN-120153033-A UV curable silicone composition 美国陶氏有机硅公司 2025-06-13 CN disclosed
US-20250171635-A1 CURABLE SILICONE COMPOSITION DOW SILICONES CORP (US) 2025-05-29 US disclosed
WO-2025038154-A1 TWO-STEP CURABLE SILICONE COMPOSITION AND METHODS FOR THE PREPARATION AND USE THEREOF DOW SILICONES CORPORATION (US) 2025-02-20 WO disclosed
US-20190276684-A1 REACTIVE HOT-MELT SILICONE FILLING CONTAINER AND METHOD FOR MANUFACTURING REACTIVE HOT-MELT SILICONE DOW TORAY CO., LTD. (JP) 2019-09-12 US disclosed
EP-3536747-A1 REACTIVE HOT-MELT SILICONE FILLING CONTAINER AND METHOD FOR MANUFACTURING REACTIVE HOT-MELT SILICONE Dow Toray Co., Ltd. (JP) 2019-09-11 EP disclosed
US-9403982-B2 Curable silicone composition and cured product thereof DOW CORNING CORPORATION (US) 2016-08-02 US disclosed
US-20150210853-A1 CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF DOW CORNING TORAY CO., LTD. (JP) 2015-07-30 US disclosed
EP-2892953-A1 CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF Dow Corning Toray Co., Ltd. (JP) 2015-07-15 EP disclosed
WO-2014038723-A1 CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF DOW CORNING TORAY CO., LTD. (JP) 2014-03-13 WO disclosed
US-8349928-B2 Metal particle dispersion structure, microparticles comprising this structure, articles coated with this structure, and methods of producing the preceding DOW CORNING TORAY CO., LTD. (JP) 2013-01-08 US disclosed
US-8093333-B2 Hot-melt silicone adhesive DOW CORNING TORAY COMPANY, LTD. (JP) 2012-01-10 US disclosed
US-20100267885-A1 Metal Particle Dispersion Structure, Microparticles Comprising This Structure, Articles Coated With This Structure, And Methods Of Producing The Preceding DOW CORNING TORAY CO., LTD. (JP) 2010-10-21 US disclosed