SCHEMBL15007014

SCHEMBL15007014

CCCCCCCCCCCCCCCCCCC(O)C(=O)NCCCCNC(=O)C(O)CCCCCCCCCCCCCCCCCC

nearest known ligand 0.58

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
GNAI3 P08754 1/20 0.58
GNAO1 P09471 1/20 0.58
GNAI1 P63096 1/20 0.58
DPP7 Q9UHL4 2/20 0.58
RRM1 P23921 1/20 0.57
GPR84 Q9NQS5 3/20 0.57
FFAR1 O14842 1/20 0.57
EPHX1 P07099 7/20 0.55
NAAA Q02083 2/20 0.53
SIRT6 Q8N6T7 1/20 0.53
SIRT1 Q96EB6 1/20 0.53
CASP2 P42575 1/20 0.50
MMP8 P22894 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15006734 1.00 GNAI3 (0.58) GNAI3GNAO1GNAI1DPP7RRM1
SCHEMBL15006879 1.00 GNAI3 (0.58) GNAI3GNAO1GNAI1DPP7RRM1
SCHEMBL15007071 1.00 GNAI3 (0.58) GNAI3GNAO1GNAI1DPP7RRM1
SCHEMBL25334804 1.00 GNAI3 (0.58) GNAI3GNAO1GNAI1DPP7RRM1
SCHEMBL15006955 1.00 GNAI3 (0.58) GNAI3GNAO1GNAI1DPP7RRM1
SCHEMBL25334168 1.00 GNAI3 (0.58) GNAI3GNAO1GNAI1DPP7RRM1
SCHEMBL10481744 1.00 GNAI3 (0.58) GNAI3GNAO1GNAI1DPP7RRM1
SCHEMBL15007034 1.00 GNAI3 (0.58) GNAI3GNAO1GNAI1DPP7RRM1
SCHEMBL3758969 1.00 GNAI3 (0.58) GNAI3GNAO1GNAI1DPP7RRM1
SCHEMBL29059567 1.00 GNAI3 (0.58) GNAI3GNAO1GNAI1DPP7RRM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9518169-B2 Polylactic acid resin composition and resin molded article thereof DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2016-12-13 US disclosed
US-9518168-B2 Polylactic acid resin composition and resin molded article thereof DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2016-12-13 US disclosed
US-9376546-B2 Polylactic acid resin composition and resin molded article thereof DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2016-06-28 US disclosed
US-20150225540-A1 POLYLACTIC ACID RESIN COMPOSITION AND RESIN MOLDED ARTICLE THEREOF DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2015-08-13 US disclosed
US-20150197622-A1 POLYLACTIC ACID RESIN COMPOSITION AND RESIN MOLDED ARTICLE THEREOF DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2015-07-16 US disclosed
US-20150197621-A1 POLYLACTIC ACID RESIN COMPOSITION AND RESIN MOLDED ARTICLE THEREOF DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2015-07-16 US disclosed
EP-2604654-B1 Polylactic acid resin composition and resin molded article thereof DAI ICHI KOGYO SEIYAKU CO LTD (JP) 2015-04-15 EP disclosed
EP-2604649-B1 Polylactic acid resin composition and resin molded article thereof DAI ICHI KOGYO SEIYAKU CO LTD (JP) 2014-05-14 EP disclosed
EP-2604653-B1 Polylactic acid resin composition and resin molded article thereof DAI ICHI KOGYO SEIYAKU CO LTD (JP) 2014-03-19 EP disclosed
EP-2604653-A1 Polylactic acid resin composition and resin molded article thereof Dai-Ichi Kogyo Seiyaku Co., Ltd. (JP) 2013-06-19 EP disclosed
EP-2604649-A1 Polylactic acid resin composition and resin molded article thereof Dai-Ichi Kogyo Seiyaku Co., Ltd. (JP) 2013-06-19 EP disclosed
EP-2604654-A2 Polylactic acid resin composition and resin molded article thereof Dai-Ichi Kogyo Seiyaku Co., Ltd. (JP) 2013-06-19 EP disclosed
US-20130150506-A1 Polylactic Acid Resin Composition and Resin Molded Article Thereof DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2013-06-13 US disclosed
US-20130150510-A1 Polylactic Acid Resin Composition and Resin Molded Article Thereof DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2013-06-13 US disclosed
US-20130150505-A1 Polylactic Acid Resin Composition and Resin Molded Article Thereof DAI-ICHI KOGYO SEIYAKU CO., LTD. (JP) 2013-06-13 US disclosed