SCHEMBL15062364

SCHEMBL15062364

Oc1ccc(-c2ccc3c(c2)-c2ccccc2C3c2ccc(O)cc2)cc1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 2/20 0.47
KMT2A Q03164 2/20 0.47
KDM4E B2RXH2 1/20 0.47
ESR1 P03372 4/20 0.47
HSD17B1 P14061 3/20 0.44
HSD17B2 P37059 3/20 0.44
ESR2 Q92731 4/20 0.42
ABL1 P00519 2/20 0.42
ABCB1 P08183 2/20 0.42
BCR P11274 2/20 0.42
MMP3 P08254 2/20 0.41
BCL2L1 Q07817 1/20 0.41
KDM1A O60341 3/20 0.41
HDAC6 Q9UBN7 1/20 0.41
USP7 Q93009 1/20 0.40
EDNRB P24530 1/20 0.39
EDNRA P25101 1/20 0.39
CYP3A4 P08684 1/20 0.38
CYP2C9 P11712 1/20 0.38
PDK2 Q15119 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29496707 0.90 MEN1 (0.47) MEN1KMT2AKDM4EESR1HSD17B1
SCHEMBL918436 0.86 KMT2A (0.61) MEN1KMT2AKDM4EESR1ESR2
SCHEMBL573085 0.80 KMT2A (0.47) MEN1KMT2AKDM4EESR1ESR2
SCHEMBL23310483 0.80 EDNRB (0.40) MEN1KMT2AKDM4EKDM1AHDAC6
SCHEMBL21959118 0.80 EDNRB (0.40) MEN1KMT2AKDM4EKDM1AHDAC6
SCHEMBL13805589 0.79 MAPK1 (0.44) MEN1KMT2AEDNRBEDNRACYP3A4
SCHEMBL24741894 0.79 EDNRB (0.50) ESR2EDNRBEDNRACYP3A4PDK2
SCHEMBL17280984 0.78 USP7 (0.40) MEN1KMT2AKDM4EESR1HSD17B1
SCHEMBL27372447 0.78 KDM1A (0.47) KDM4EMMP3BCL2L1KDM1ACYP3A4
SCHEMBL3465804 0.77 HSD17B1 (0.46) MEN1KMT2AESR1HSD17B1HSD17B2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2610307-A1 CONTACT COMPONENT WITH REDUCED SQUEAK NOISE MADE FROM THERMOPLASTIC RESIN COMPOSITION Techno Polymer Co., Ltd. (JP) 2013-07-03 EP disclosed