SCHEMBL15065009

SCHEMBL15065009

CC/C=C/C(OCC1CO1)[Si](OCC)(OCC)OCC

nearest known ligand 0.32

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 1/20 0.31
ALDH1A1 P00352 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15065010 1.00 SMN1; SMN2 (0.31) SMN1; SMN2ALDH1A1
SCHEMBL15064806 0.86 SMN1; SMN2 (0.32) SMN1; SMN2ALDH1A1
SCHEMBL15064804 0.86 SMN1; SMN2 (0.32) SMN1; SMN2ALDH1A1
SCHEMBL15065344 0.86 SMN1; SMN2 (0.32) SMN1; SMN2ALDH1A1
SCHEMBL15065343 0.86 SMN1; SMN2 (0.32) SMN1; SMN2ALDH1A1
SCHEMBL15064929 0.81 ALDH1A1 (0.37) SMN1; SMN2ALDH1A1
SCHEMBL27902466 0.80
SCHEMBL27902470 0.79
SCHEMBL188051 0.74 SMN1; SMN2 (0.36) SMN1; SMN2ALDH1A1
SCHEMBL16430090 0.72 ALDH1A1 (0.36) SMN1; SMN2ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2618216-B1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF CREATING RESIST PATTERN, AND ELECTRONIC COMPONENT HITACHI CHEMICAL CO LTD (JP) 2019-05-29 EP disclosed
US-8836089-B2 Positive photosensitive resin composition, method of creating resist pattern, and electronic component HITACHI CHEMICAL COMPANY, LTD. (JP) 2014-09-16 US disclosed
EP-2618216-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF CREATING RESIST PATTERN, AND ELECTRONIC COMPONENT Hitachi Chemical Co., Ltd. (JP) 2013-07-24 EP disclosed
US-20130168859-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF CREATING RESIST PATTERN, AND ELECTRONIC COMPONENT RESONAC CORPORATION (JP) 2013-07-04 US disclosed