SCHEMBL15065100

SCHEMBL15065100

CC=C(OCC1CO1)[Si](OC)(OC)OC

nearest known ligand 0.41

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.41
TP53 P04637 1/20 0.41
CYP3A4 P08684 1/20 0.41
TSHR P16473 2/20 0.33
MAPK1 P28482 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.32
TDP1 Q9NUW8 1/20 0.31
MGLL Q99685 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15065099 1.00 ALDH1A1 (0.41) ALDH1A1TP53CYP3A4TSHRMAPK1
SCHEMBL15064601 0.84 ALDH1A1 (0.38) ALDH1A1TP53CYP3A4TSHRMAPK1
SCHEMBL15064602 0.84 ALDH1A1 (0.38) ALDH1A1TP53CYP3A4TSHRMAPK1
SCHEMBL15064634 0.82 ALDH1A1 (0.39) ALDH1A1TP53CYP3A4TSHRMAPK1
SCHEMBL15064635 0.82 ALDH1A1 (0.39) ALDH1A1TP53CYP3A4TSHRMAPK1
SCHEMBL15065138 0.82 ALDH1A1 (0.36) ALDH1A1TP53CYP3A4SMN1; SMN2TDP1
SCHEMBL15065139 0.82 ALDH1A1 (0.36) ALDH1A1TP53CYP3A4SMN1; SMN2TDP1
SCHEMBL15064950 0.71 ALDH1A1 (0.39) ALDH1A1TP53CYP3A4TSHRMAPK1
SCHEMBL15064951 0.71 ALDH1A1 (0.39) ALDH1A1TP53CYP3A4TSHRMAPK1
SCHEMBL27439250 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2618216-B1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF CREATING RESIST PATTERN, AND ELECTRONIC COMPONENT HITACHI CHEMICAL CO LTD (JP) 2019-05-29 EP disclosed
US-8836089-B2 Positive photosensitive resin composition, method of creating resist pattern, and electronic component HITACHI CHEMICAL COMPANY, LTD. (JP) 2014-09-16 US disclosed
EP-2618216-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF CREATING RESIST PATTERN, AND ELECTRONIC COMPONENT Hitachi Chemical Co., Ltd. (JP) 2013-07-24 EP disclosed
US-20130168859-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD OF CREATING RESIST PATTERN, AND ELECTRONIC COMPONENT RESONAC CORPORATION (JP) 2013-07-04 US disclosed