Ethylene

Ethylene

SCHEMBL15065635

C=C.OCC(O)COCC(O)CO

nearest known ligand 0.48

Full drug profile on Sugi Atlas →

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
USP2 O75604 1/20 0.48
LMNA P02545 4/20 0.47
ALDH1A1 P00352 1/20 0.47
KDM4E B2RXH2 4/20 0.39
THRB P10828 1/20 0.38
CA1 P00915 1/20 0.36
CA2 P00918 1/20 0.36
CA7 P43166 1/20 0.36
CYP1A2 P05177 3/20 0.34
AGTR1 P30556 1/20 0.34
MEN1 O00255 2/20 0.33
KMT2A Q03164 2/20 0.33
DUSP3 P51452 1/20 0.33
TSHR P16473 1/20 0.32
MAPK1 P28482 1/20 0.32
CYP2C19 P33261 1/20 0.32
HSD17B10 Q99714 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30754 0.94 LMNA (0.53) USP2LMNAALDH1A1KDM4ETHRB
SCHEMBL1638881 0.94 LMNA (0.53) USP2LMNAALDH1A1KDM4ETHRB
SCHEMBL15894238 0.90 LMNA (0.50) USP2LMNAALDH1A1KDM4ETHRB
SCHEMBL10329835 0.90 LMNA (0.50) USP2LMNAALDH1A1KDM4ETHRB
Glycerin SCHEMBL314170 0.90 LMNA (0.60) USP2LMNAALDH1A1KDM4ETHRB
SCHEMBL25238278 0.90 LMNA (0.50) USP2LMNAALDH1A1KDM4ETHRB
SCHEMBL821029 0.90 LMNA (0.50) USP2LMNAALDH1A1KDM4ETHRB
Glycerin SCHEMBL2582537 0.90 LMNA (0.60) USP2LMNAALDH1A1KDM4ETHRB
SCHEMBL22279336 0.90 LMNA (0.50) USP2LMNAALDH1A1KDM4ETHRB
SCHEMBL6249798 0.90 LMNA (0.50) USP2LMNAALDH1A1KDM4ETHRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10759968-B2 Abrasive, abrasive set, and method for polishing substrate HITACHI CHEMICAL COMPANY, LTD. (JP) 2020-09-01 US disclosed
US-10373863-B2 Method of manufacturing porous body, porous body, method of manufacturing device, device, method of manufacturing wiring structure, and wiring structure FUJIFILM CORPORATION (JP) 2019-08-06 US disclosed
US-20180320024-A1 ABRASIVE, ABRASIVE SET, AND METHOD FOR POLISHING SUBSTRATE RESONAC CORPORATION (JP) 2018-11-08 US disclosed
US-10030172-B2 Abrasive, abrasive set, and method for polishing substrate HITACHI CHEMICAL COMPANY, LTD. (JP) 2018-07-24 US disclosed
US-20170200639-A1 METHOD OF MANUFACTURING POROUS BODY, POROUS BODY, METHOD OF MANUFACTURING DEVICE, DEVICE, METHOD OF MANUFACTURING WIRING STRUCTURE, AND WIRING STRUCTURE FUJIFILM CORPORATION (JP) 2017-07-13 US disclosed
US-20160319159-A1 ABRASIVE, ABRASIVE SET, AND METHOD FOR POLISHING SUBSTRATE RESONAC CORPORATION (JP) 2016-11-03 US disclosed
US-20140370308-A1 LAMINATE FILM FOR ATTACHING TO A WINDOW, AND A MANUFACTURING METHOD THEREOF AND AN APPLYING METHOD THEREOF 3M INNOVATIVE PROPERTIES CO (US) 2014-12-18 US disclosed
WO-2013101685-A1 A LAMINATE FILM FOR ATTACHING TO A WINDOW, AND A MANUFACTURING METHOD THEREOF AND AN APPLYING METHOD THEREOF 3M INNOVATIVE PROPERTIES COMPANY (US) 2013-07-04 WO disclosed