SCHEMBL1506909

SCHEMBL1506909

CCCCCC(=O)OCC.[Si]

nearest known ligand 0.68

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
DGKA P23743 1/20 0.68
CYP1A2 P05177 1/20 0.61
PAM P19021 2/20 0.61
TSHR P16473 2/20 0.57
MAPT P10636 1/20 0.57
LMNA P02545 4/20 0.55
ALDH1A1 P00352 2/20 0.55
DNM1 Q05193 1/20 0.55
KDM4E B2RXH2 1/20 0.53
DUSP3 P51452 1/20 0.53
MEN1 O00255 1/20 0.53
KMT2A Q03164 1/20 0.53
PRKCA P17252 1/20 0.50
PRKCE Q02156 1/20 0.50
PRKCQ Q04759 1/20 0.50
PRKCD Q05655 1/20 0.50
MGAM O43451 1/20 0.50
GAA P10253 1/20 0.50
SI P14410 1/20 0.50
MGAM2 Q2M2H8 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31352662 0.98 DGKA (0.71) DGKACYP1A2PAMTSHRMAPT
SCHEMBL37297 0.98 DGKA (0.71) DGKACYP1A2PAMTSHRMAPT
SCHEMBL2309907 0.95 DGKA (0.68) DGKACYP1A2PAMTSHRMAPT
Hexane SCHEMBL2349171 0.95 DGKA (0.75) DGKACYP1A2PAMTSHRMAPT
SCHEMBL116995 0.95 DGKA (0.75) DGKACYP1A2PAMTSHRMAPT
SCHEMBL20543804 0.95 DGKA (0.68) DGKACYP1A2PAMTSHRMAPT
SCHEMBL8375548 0.95 DGKA (0.75) DGKACYP1A2PAMTSHRMAPT
SCHEMBL19252993 0.95 DGKA (0.68) DGKACYP1A2PAMTSHRMAPT
SCHEMBL2558423 0.95 DGKA (0.68) DGKACYP1A2PAMTSHRMAPT
SCHEMBL22129520 0.95 DGKA (0.68) DGKACYP1A2PAMTSHRMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2436661-B1 Composition for ferroelectric thin film formation and method for forming ferroelectric thin film MITSUBISHI MATERIALS CORP (JP) 2016-03-30 EP claimed
US-8859051-B2 Composition for ferroelectric thin film formation, method for forming ferroelectric thin film and ferroelectric thin film formed by the method thereof MITSUBISHI MATERIALS CORPORATION (JP) 2014-10-14 US claimed
US-9502636-B2 Composition for ferroelectric thin film formation, method for forming ferroelectric thin film, and ferroelectric thin film formed by the method thereof MITSUBISHI MATERIALS CORPORATION (JP) 2016-11-22 US disclosed
EP-2436661-B1 Composition for ferroelectric thin film formation and method for forming ferroelectric thin film MITSUBISHI MATERIALS CORP (JP) 2016-03-30 EP disclosed
US-9005358-B2 Composition for ferroelectric thin film formation, method for forming ferroelectric thin film, and ferroelectric thin film formed by the method thereof MITSUBISHI MATERIALS CORPORATION (JP) 2015-04-14 US disclosed
US-20140349139-A1 COMPOSITION FOR FERROELECTRIC THIN FILM FORMATION, METHOD FOR FORMING FERROELECTRIC THIN FILM, AND FERROELECTRIC THIN FILM FORMED BY THE METHOD THEREOF MITSUBISHI MATERIALS CORPORATION (JP) 2014-11-27 US disclosed
US-20140349834-A1 COMPOSITION FOR FERROELECTRIC THIN FILM FORMATION, METHOD FOR FORMING FERROELECTRIC THIN FILM, AND FERROELECTRIC THIN FILM FORMED BY THE METHOD THEREOF MITSUBISHI MATERIALS CORP (JP) 2014-11-27 US disclosed
US-8859051-B2 Composition for ferroelectric thin film formation, method for forming ferroelectric thin film and ferroelectric thin film formed by the method thereof MITSUBISHI MATERIALS CORPORATION (JP) 2014-10-14 US disclosed
US-8790538-B2 Composition for ferroelectric thin film formation, method for forming ferroelectric thin film, and ferroelectric thin film formed by the method thereof MITSUBISHI MATERIALS CORPORATION (JP) 2014-07-29 US disclosed
US-20130295414-A1 COMPOSITION FOR FERROELECTRIC THIN FILM FORMATION, METHOD FOR FORMING FERROELECTRIC THIN FILM, AND FERROELECTRIC THIN FILM FORMED BY THE METHOD THEREOF MITSUBISHI MATERIALS CORP (JP) 2013-11-07 US disclosed
US-20110177235-A1 COMPOSITION FOR FERROELECTRIC THIN FILM FORMATION, METHOD FOR FORMING FERROELECTRIC THIN FILM, AND FERROELECTRIC THIN FILM FORMED BY THE METHOD THEREOF MITSUBISHI MATERIALS CORPORATION (JP) 2011-07-21 US disclosed
EP-2343268-A1 Composition for ferroelectric thin film formation, method for forming ferroelectric thin film, and ferroelectric thin film formed by the method thereof Mitsubishi Materials Corporation (JP) 2011-07-13 EP disclosed
US-20110098173-A1 Composition for ferroelectric thin film formation, method for forming ferroelectric thin film, and ferroelectric thin film formed by the method thereof STMicroelectronics(Tours) SAS (FR) 2011-04-28 US disclosed
EP-2298714-A1 COMPOSITION FOR FERROELECTRIC THIN FILM FORMATION, METHOD FOR FERROELECTRIC THIN FILM FORMATION, AND FERROELECTRIC THIN FILM FORMED BY THE METHOD Mitsubishi Materials Corporation (JP) 2011-03-23 EP disclosed