SCHEMBL15085274

SCHEMBL15085274

CC(CCC(=O)O)(c1ccc(O)cc1)C1C=CC(O)=CC1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR2 Q92731 5/20 0.50
ESR1 P03372 4/20 0.50
CYP3A4 P08684 3/20 0.50
ALDH1A1 P00352 2/20 0.50
CHEK1 O14757 1/20 0.36
FYN P06241 1/20 0.36
PDGFRB P09619 1/20 0.36
PIM1 P11309 1/20 0.36
FGFR1 P11362 1/20 0.36
FLT1 P17948 1/20 0.36
GRK5 P34947 1/20 0.36
MAP2K2 P36507 1/20 0.36
MAPK8 P45983 1/20 0.36
CDK8 P49336 1/20 0.36
RPS6KA3 P51812 1/20 0.36
PRKX P51817 1/20 0.36
JAK3 P52333 1/20 0.36
LIMK1 P53667 1/20 0.36
BTK Q06187 1/20 0.36
TYRO3 Q06418 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23734757 0.81 ESR2 (0.35) ESR2ESR1CYP3A4ALDH1A1TSHR
SCHEMBL23734903 0.79 MIF (0.32) ESR2ESR1CYP3A4ALDH1A1ESRRG
SCHEMBL22787118 0.78 ESR1 (0.33) ESR2ESR1CYP3A4TSHRHSD17B10
SCHEMBL12527405 0.77 ALDH1A1 (0.30) ESR2ESR1CYP3A4ALDH1A1
SCHEMBL21183288 0.75 ESR2 (0.39) ESR2ESR1CYP3A4ALDH1A1TSHR
SCHEMBL22787141 0.73 ESR2 (0.46) ESR2ESR1CYP3A4ALDH1A1TSHR
SCHEMBL14063905 0.72 ESR1 (0.48) ESR2ESR1CYP3A4ALDH1A1TSHR
SCHEMBL21340122 0.71 ALDH1A1 (0.46) CYP3A4ALDH1A1TSHRHIF1ALMNA
SCHEMBL19117166 0.69 ESR2 (0.59) ESR2ESR1CYP3A4ALDH1A1CHEK1
SCHEMBL75695 0.68 ESR1 (1.00) ESR2ESR1CYP3A4ALDH1A1CHEK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10409163-B2 Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device TORAY INDUSTRIES, INC. (JP) 2019-09-10 US disclosed
US-20170285477-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2017-10-05 US disclosed
US-20170285477-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2017-10-05 US disclosed
EP-3203320-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Toray Industries, Inc. (JP) 2017-08-09 EP disclosed
WO-2016052268-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 東レ株式会社 2016-04-07 WO disclosed
WO-2013099785-A1 PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR PRODUCING SEMICONDUCTOR ELEMENT 東レ株式会社 (JP) 2013-07-04 WO disclosed