SCHEMBL1509033

SCHEMBL1509033

[Al].[Al].[Ti]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15865 1.00
SCHEMBL9874288 1.00
SCHEMBL29978162 1.00
SCHEMBL8971269 1.00
SCHEMBL6282685 1.00
SCHEMBL8971734 1.00
SCHEMBL6448948 1.00
SCHEMBL2285707 1.00
SCHEMBL3934609 1.00
SCHEMBL161826 1.00

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 105 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119710499-A High-toughness aluminum-titanium-aluminum alloy and preparation method thereof 池州市九华明坤铝业有限公司 2025-03-28 CN claimed
CN-118477906-A Light high-strength corrosion-resistant multilayer aluminum-titanium composite board and preparation method thereof 武汉大学 2024-08-13 CN claimed
CN-117202735-A Display panel, preparation method thereof and mask plate 云谷(固安)科技有限公司 2023-12-08 CN claimed
CN-114393036-B Preparation method of titanium-aluminum composite board 攀枝花学院 2023-11-07 CN claimed
CN-114393036-A Preparation method of titanium-aluminum composite board 攀枝花学院 2022-04-26 CN claimed
CN-215293225-U Aluminum-titanium-aluminum hybrid breakage-proof single lug structure 中国航空工业集团公司西安飞机设计研究所 2021-12-24 CN claimed
CN-107801350-A The flat phase transformation of one side suppresses heat sink and mobile terminal device 浙江嘉熙科技有限公司 2018-03-13 CN claimed
US-9080224-B2 Method and apparatus for forming titanium-aluminium based alloys COMMONWEALTH SCIENCE AND INDUSTRIAL RESEARCH ORGANIZATION (AU) 2015-07-14 US claimed
US-20130319177-A1 METHOD AND APPARATUS FOR FORMING TITANIUM-ALUMINIUM BASED ALLOYS COMMW SCIENT IND RES ORG (AU) 2013-12-05 US claimed
US-20110091350-A1 METHOD AND APPARATUS FOR FORMING TITANIUM-ALUMINIUM BASED ALLOYS COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESEARCH ORGANISATION (AU) 2011-04-21 US claimed
EP-2296805-A1 METHOD AND APPARATUS FOR FORMING TITANIUM-ALUMINIUM BASED ALLOYS Commonwealth Scientific and Industrial Research Organisation (AU) 2011-03-23 EP claimed
WO-2009129570-A1 METHOD AND APPARATUS FOR FORMING TITANIUM-ALUMINIUM BASED ALLOYS COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESEARCH ORGANISATION (AU) 2009-10-29 WO claimed
CN-1140115-A Al-Ti-Al solder tri-layer rolling composite plate and use method thereof XIBEI NON FERROUS METALS INST (CN) 1997-01-15 CN claimed
US-5527738-A UTILIZING MULTICONTACT MEDIATORS THAT SECURE SUFFICIENT ALLOWANCE TO PREVENT FORMATION OF SHORT CIRCUITS HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. (KR) 1996-06-18 US claimed
US-5494860-A ANNEALING IN INERT, HYDROGEN-FREE ATMOSPHERE FOLLOWED BY ANNEALING IN A HYDROGEN-CONTAINING ATMOSPHERE; MINIMIZES ELECTRICAL LEAKAGE INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1996-02-27 US claimed
JP-7249652-A None JP disclosed
CN-121289247-B Preparation method of high-strength high-plasticity high-toughness multilayer titanium-aluminum composite board 东北大学 2026-05-05 CN disclosed
JP-H07249652-A MANUFACTURE OF SEMICONDUCTOR DEVICE MATSUSHITA ELECTRON CORP 1995-09-26 JP disclosed
EP-0459770-B1 Method for producing a semiconductor device with gate structure CANON KK (JP) 1995-05-03 EP disclosed
US-4255592-A PEROXIDATION OF METHYL SUBSTITUTED BENZENE IN LIQUID PHASE, ALIPHATIC TERT-HYDROPEROXIDE PROMOTER MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1981-03-10 US disclosed