⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1260382 | 0.79 | — | — | |
| SCHEMBL26585892 | 0.77 | — | — | |
| SCHEMBL2438532 | 0.77 | — | — | |
| SCHEMBL2014765 | 0.77 | ALDH1A1 (0.30) | — | |
| SCHEMBL22242501 | 0.73 | — | — | |
| SCHEMBL9006357 | 0.72 | — | — | |
| SCHEMBL6899401 | 0.72 | — | — | |
| Bromide SCHEMBL31208449 | 0.72 | KCNN4 (0.32) | — | |
| SCHEMBL22388458 | 0.69 | — | — | |
| SCHEMBL1061677 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 798 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240209138-A1 | PRODUCTION OF HARD POLYURETHANE OR POLYISOCYANURATE FOAM | EVONIK OPERATIONS GMBH (DE) | 2024-06-27 | — | — | US | claimed |
| CN-118201895-A | Polymer-free and low-odor urease inhibitor formulations with improved storage stability on urea | 巴斯夫欧洲公司 | 2024-06-14 | — | — | CN | claimed |
| CN-118085973-A | Post-chemical mechanical polishing formulations and methods of use thereof | 恩特格里斯公司 | 2024-05-28 | — | — | CN | claimed |
| EP-4355726-A1 | POLYMERIC FATTY ACID SALT COMPOUNDS FOR THE TREATMENT OF FIBROUS AMINO ACID-BASED SUBSTRATES, ESPECIALLY HAIR | Momentive Performance Materials GmbH (DE) | 2024-04-24 | — | — | EP | claimed |
| CN-117720875-A | Polyurethane adhesive and preparation method and application thereof | 江苏长能节能新材料科技有限公司 | 2024-03-19 | — | — | CN | claimed |
| US-11845917-B2 | Compositions and methods for post-CMP cleaning of cobalt substrates | ENTEGRIS, INC. (US) | 2023-12-19 | — | — | US | claimed |
| EP-4021866-B1 | ACRYLIC-BASED INJECTION MATERIALS WITH IMPROVED CURING PROPERTIES | SIKA TECH AG (CH) | 2023-11-22 | — | — | EP | claimed |
| CN-116836358-A | Open-cell rigid polyurethane foam, and preparation method and application thereof | 江苏长能节能新材料科技有限公司 | 2023-10-03 | — | — | CN | claimed |
| WO-2023117926-A1 | ENVIRONMENTAL ATTRIBUTES FOR NITROGEN CONTAINING CHEMICALS | BASF SE (DE) | 2023-06-29 | — | — | WO | claimed |
| CN-116333256-A | Polyurethane foam material for LNG pipeline and preparation method thereof | 江苏长能节能新材料科技有限公司 | 2023-06-27 | — | — | CN | claimed |
| WO-2009079994-A2 | MIXTURE FOR THE TREATMENT OF UREA-CONTAINING FERTILIZERS | FERTIVA GMBH (DE) | 2009-07-02 | — | — | WO | claimed |
| US-20080006305-A1 | Resist, Barc and Gap Fill Material Stripping Chemical and Method | TRUIST BANK, AS NOTES COLLATERAL AGENT | 2008-01-10 | — | — | US | claimed |
| EP-1690135-A4 | RESIST, BARC AND GAP FILL MATERIAL STRIPPING CHEMICAL AND METHOD | ADVANCED TECH MATERIALS (US) | 2007-05-09 | — | — | EP | claimed |
| US-20070072782-A1 | Unsaturated dicarboxylic acid and ethylene urea containing formulation for cleaning semiconductor and cleaning method | NISSAN CHEMICAL INDUSTRIES, LTD (JP) | 2007-03-29 | — | — | US | claimed |
| EP-1690135-A2 | RESIST, BARC AND GAP FILL MATERIAL STRIPPING CHEMICAL AND METHOD | Advanced Technology Materials, Inc. (US) | 2006-08-16 | — | — | EP | claimed |
| EP-1684337-A1 | CLEANING COMPOSITION FOR SEMICONDUCTOR CONTAINING UNSATURATED DICARBOXYLIC ACID AND ETHYLENE UREA AND CLEANING METHOD | Nissan Chemical Industries, Ltd. (JP) | 2006-07-26 | — | — | EP | claimed |
| US-6946396-B2 | Maleic acid and ethylene urea containing formulation for removing residue from semiconductor substrate and method for cleaning wafer | NISSAN CHEMICAL INDUSRIES, LTD. (JP) | 2005-09-20 | — | — | US | claimed |
| WO-2005057281-A2 | RESIST, BARC AND GAP FILL MATERIAL STRIPPING CHEMICAL AND METHOD | ADVANCED TECHNOLOGY MATERIALS, INC. (US) | 2005-06-23 | — | — | WO | claimed |
| US-20050096237-A1 | Maleic acid and ethylene urea containing formulation for removing residue from semiconductor substrate and method for cleaning wafer | NISSAN CHEMICAL INDUSTRIES, LTD. (JP) | 2005-05-05 | — | — | US | claimed |
| US-4026840-A | POLYMERIZATION OF POLYURETHANES | AIR PRODUCTS AND CHEMICALS, INC. (US) | 1977-05-31 | — | — | US | claimed |