SCHEMBL15099559

SCHEMBL15099559

C=C[Si](C)(C)c1ccc([Si](C)(C)CCCOCC2CO2)cc1

nearest known ligand 0.44

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.44
SMN1; SMN2 Q16637 1/20 0.43
ALDH1A1 P00352 3/20 0.41
TDP1 Q9NUW8 1/20 0.41
NR1H2 P55055 1/20 0.33
NR1H3 Q13133 1/20 0.33
MAPK1 P28482 1/20 0.31
MEN1 O00255 1/20 0.31
KMT2A Q03164 1/20 0.31
GLA P06280 1/20 0.31
MGAM O43451 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2732182 0.89 TSHR (0.55) TSHRSMN1; SMN2ALDH1A1TDP1NR1H2
SCHEMBL26780359 0.83 SMN1; SMN2 (0.51) TSHRSMN1; SMN2ALDH1A1TDP1NR1H2
SCHEMBL26780305 0.82 TSHR (0.47) TSHRSMN1; SMN2ALDH1A1TDP1NR1H2
SCHEMBL6656047 0.82 TSHR (0.50) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL26780316 0.80 TSHR (0.45) TSHRSMN1; SMN2ALDH1A1TDP1NR1H2
SCHEMBL26780285 0.79 TSHR (0.44) TSHRSMN1; SMN2ALDH1A1TDP1NR1H2
SCHEMBL26780556 0.79 TSHR (0.44) TSHRSMN1; SMN2ALDH1A1TDP1NR1H2
SCHEMBL26780687 0.74 TSHR (0.39) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL27777190 0.74 TSHR (0.59) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL3922211 0.73 TSHR (0.41) TSHRSMN1; SMN2ALDH1A1TDP1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8673537-B2 Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-03-18 US disclosed
EP-2333015-B1 Photo-curable resin composition, pattern forming method and substrate protecting film, and film-shaped adhesive and adhesive sheet using said composition SHINETSU CHEMICAL CO (JP) 2013-07-10 EP disclosed