⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL56586 | 0.80 | — | — | |
| SCHEMBL4231337 | 0.77 | TSHR (0.32) | — | |
| SCHEMBL2273059 | 0.70 | — | — | |
| SCHEMBL4593557 | 0.69 | — | — | |
| SCHEMBL2276680 | 0.69 | — | — | |
| SCHEMBL3813580 | 0.69 | — | — | |
| SCHEMBL2156705 | 0.67 | — | — | |
| SCHEMBL380183 | 0.63 | — | — | |
| SCHEMBL8849396 | 0.63 | — | — | |
| SCHEMBL28206922 | 0.61 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4574865-A1 | COATING PRIMER HAVING GOOD APPLICABILITY AT LOW TEMPERATURES | Sika Technology AG (CH) | 2025-06-25 | — | — | EP | disclosed |
| WO-2021228623-A1 | COATING SYSTEM HAVING HIGH SURFACE ROUGHNESS | SIKA TECHNOLOGY AG (CH) | 2021-11-18 | — | — | WO | disclosed |
| US-10975276-B2 | Aqueous adhesive composition based on epoxy resin with improved adhesion and storage stability | SIKA TECHNOLOGY AG (CH) | 2021-04-13 | — | — | US | disclosed |
| CN-107075337-B | Adhesive system with highly reactive pretreatment | SIKA技术股份公司 | 2021-02-09 | — | — | CN | disclosed |
| US-20180215968-A1 | AQUEOUS ADHESIVE COMPOSITION BASED ON EPOXY RESIN WITH IMPROVED ADHESION AND STORAGE STABILITY | SIKA TECHNOLOGY AG (CH) | 2018-08-02 | — | — | US | disclosed |
| EP-3209740-A1 | ADHESIVE SYSTEM WITH HIGHLY REACTIVE PRETREATMENT AGENT | Sika Technology AG (CH) | 2017-08-30 | — | — | EP | disclosed |
| CN-102036929-B | Containing the adhesion promoter composition of aromatics secondary amino silanes | SIKA TECHNOLOGY AG (CH) | 2016-01-20 | — | — | CN | disclosed |
| CN-104093798-A | Water based primer composition for bonding glass into a structure | DOW GLOBAL TECHNOLOGIES INC | 2014-10-08 | — | — | CN | disclosed |
| CN-102985385-A | Water based primer composition for isocyante and silane functional adhesives | DOW GLOBAL TECHNOLOGIES LLC | 2013-03-20 | — | — | CN | disclosed |
| CN-101573305-B | Low temperature adhesive primer composition | SIKA TECHNOLOGY AG | 2013-03-13 | — | — | CN | disclosed |
| WO-2009150064-A2 | AROMATIC SECONDARY ADHESIVE COMPOSITIONS CONTAINING AMINOSILANE | SIKA TECHNOLOGY AG (CH) | 2009-12-17 | — | — | WO | disclosed |
| CN-101591466-A | The adhesion promoter composition that comprises Resins, epoxy | SIKA TECHNOLOGY AG (CH) | 2009-12-02 | — | — | CN | disclosed |
| CN-101573305-A | Low temperature adhesive primer composition | SIKA TECHNOLOGY AG (CH) | 2009-11-04 | — | — | CN | disclosed |
| EP-2094618-A1 | LOW-TEMPERATURE ADHESIVE UNDERCOAT COMPOSITION | Sika Technology AG (CH) | 2009-09-02 | — | — | EP | disclosed |
| CN-101511928-A | Aqueous adhesion promoter composition comprising an aminosilane and a mercaptosilane | SIKA TECHNOLOGY AG (CH) | 2009-08-19 | — | — | CN | disclosed |
| CN-101312778-A | Mixing device for liquids | SIKA TECHNOLOGY AG (CH) | 2008-11-26 | — | — | CN | disclosed |
| CN-101305013-A | Surfactant-stabilized organoalkoxysilane composition | SIKA TECHNOLOGY AG (CH) | 2008-11-12 | — | — | CN | disclosed |
| WO-2008061981-A1 | LOW-TEMPERATURE ADHESIVE UNDERCOAT COMPOSITION | SIKA TECHNOLOGY AG (CH) | 2008-05-29 | — | — | WO | disclosed |
| CN-101166773-A | Moisture-curable composition featuring increased elasticity | SIKA TECHNOLOGY AG (CH) | 2008-04-23 | — | — | CN | disclosed |
| CN-1923938-A | Two-component aqueous organoalkoxysilane composition | SIKA TECHNOLOGY AG (CH) | 2007-03-07 | — | — | CN | disclosed |