SCHEMBL2156705

SCHEMBL2156705

CCN[SiH](CC(C)C)C(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21625748 0.78
SCHEMBL3813580 0.76
SCHEMBL1532359 0.67
SCHEMBL8466707 0.66 ALDH1A1 (0.36)
SCHEMBL8849406 0.66
SCHEMBL30387480 0.64
SCHEMBL8849044 0.64
SCHEMBL28958309 0.63
SCHEMBL1897103 0.62
SCHEMBL8849352 0.62

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4703405-A1 CRYSTALLINE POLYOXYALKYLENE-BASED POLYMER AND CURABLE COMPOSITION COMPRISING SAME Kaneka Corporation (JP) 2026-03-04 EP disclosed
EP-4692259-A1 PRIMER COMPOSITION AND LAMINATE Kaneka Corporation (JP) 2026-02-11 EP disclosed
EP-4484500-B1 CURABLE COMPOSITION, CURED PRODUCT THEREOF, ADHESIVE AGENT COMPRISING THE COMPOSITION AND LAMINATED BODY KANEKA CORP (JP) 2025-11-26 EP disclosed
EP-4640763-A1 EMULSION COMPOSITION AND PRODUCTION METHOD THEREFOR Kaneka Corporation (JP) 2025-10-29 EP disclosed
EP-4596622-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2025-08-06 EP disclosed
EP-4134390-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2025-06-18 EP disclosed
EP-4105262-B1 CURABLE COMPOSITION AND CURED PRODUCT THEREOF KANEKA CORP (JP) 2025-04-02 EP disclosed
EP-4484500-A1 CURABLE COMPOSITION AND USE OF SAME Kaneka Corporation (JP) 2025-01-01 EP disclosed
WO-2024224831-A1 CRYSTALLINE POLYOXYALKYLENE-BASED POLYMER AND CURABLE COMPOSITION COMPRISING SAME 株式会社カネカ 2024-10-31 WO disclosed
CN-118804953-A Curable composition and use thereof 株式会社钟化 2024-10-18 CN disclosed
CN-115380081-A Curable composition 株式会社钟化 2022-11-22 CN disclosed
WO-2021162048-A1 CURABLE COMPOSITION AND CURED PRODUCT THEREOF 株式会社カネカ 2021-08-19 WO disclosed
WO-2021162049-A1 HEAT-CURABLE COMPOSITION, AND CURED PRODUCT THEREOF 株式会社カネカ 2021-08-19 WO disclosed
EP-1746135-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2019-05-29 EP disclosed
US-7973108-B2 Curable composition KANEKA CORPORATION (JP) 2011-07-05 US disclosed
EP-1985666-B1 CURABLE COMPOSITION KANEKA CORP (JP) 2010-12-15 EP disclosed
US-20090182099-A1 CURABLE COMPOSITION KANEKA CORPORATION (JP) 2009-07-16 US disclosed
US-20080319152-A1 Curable Composition KANEKA CORPORATION (JP) 2008-12-25 US disclosed
EP-1985666-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2008-10-29 EP disclosed
EP-1746135-A1 CURABLE COMPOSITION Kaneka Corporation (JP) 2007-01-24 EP disclosed