SCHEMBL15364103

SCHEMBL15364103

CC(O)CN(C)C(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12942606 1.00
SCHEMBL2058316 0.81
SCHEMBL5260439 0.77
SCHEMBL25724340 0.77
SCHEMBL18124381 0.76 TSHR (0.35)
SCHEMBL27000129 0.75
SCHEMBL4158985 0.75 LMNA (0.40)
SCHEMBL1409070 0.75 TSHR (0.32)
SCHEMBL18625030 0.75 TSHR (0.45)
SCHEMBL18756469 0.75 LMNA (0.40)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9994593-B2 Copper compound, starting material for forming thin film, and method for manufacturing thin film ADEKA CORPORATION (JP) 2018-06-12 US disclosed
US-9056438-B2 Curable composition, articles comprising the curable composition, and method of making the same 3M INNOVATIVE PROPERTIES COMPANY (US) 2015-06-16 US disclosed
US-20130295311-A1 CURABLE COMPOSITION, ARTICLES COMPRISING THE CURABLE COMPOSITION, AND METHOD OF MAKING THE SAME 3M INNOVATIVE PROPERTIES COMPANY 2013-11-07 US disclosed
WO-2013165648-A1 CURABLE COMPOSITION, ARTICLES COMPRISING THE CURABLE COMPOSITION, AND METHOD OF MAKING THE SAME 3M INNOVATIVE PROPERTIES COMPANY (US) 2013-11-07 WO disclosed