SCHEMBL15411477

SCHEMBL15411477

CCCC/C=C/N=C=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8588404 1.00
SCHEMBL11329298 0.91 FAAH (0.48)
SCHEMBL5162195 0.91 FAAH (0.48)
SCHEMBL7029383 0.91 FAAH (0.48)
SCHEMBL4372342 0.91 FAAH (0.48)
SCHEMBL11706913 0.91 FAAH (0.48)
SCHEMBL6320419 0.91 FAAH (0.48)
SCHEMBL11612560 0.91 FAAH (0.48)
SCHEMBL11705528 0.91 FAAH (0.48)
SCHEMBL11329294 0.91 FAAH (0.48)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3681476-B1 TRANSDERMAL FORMULATIONS TYME INC (US) 2022-09-14 EP claimed
US-20200405680-A1 TRANSDERMAL FORMULATIONS TYME, INC. (US) 2020-12-31 US claimed
EP-3681476-A1 TRANSDERMAL FORMULATIONS Tyme, Inc. (US) 2020-07-22 EP claimed
CN-111328278-A Transdermal preparation 迪美公司 2020-06-23 CN claimed
WO-2019055747-A1 TRANSDERMAL FORMULATIONS TYME, INC. (US) 2019-03-21 WO claimed
CN-116096824-B Modified natural product and use thereof 大金工业株式会社 2025-04-29 CN disclosed
EP-4219638-A1 MODIFIED NATURAL MATERIAL AND USE THEREOF Daikin Industries, Ltd. (JP) 2023-08-02 EP disclosed
US-20230220217-A1 MODIFIED NATURAL MATERIAL AND USE THEREOF DAIKIN INDUSTRIES, LTD. (JP) 2023-07-13 US disclosed
CN-116096824-A Modified natural product and use thereof 大金工业株式会社 2023-05-09 CN disclosed
EP-3681476-B1 TRANSDERMAL FORMULATIONS TYME INC (US) 2022-09-14 EP disclosed
CN-109563376-B Two-liquid mixed adhesive 株式会社E-TEC 2022-07-05 CN disclosed
WO-2022065382-A1 MODIFIED NATURAL MATERIAL AND USE THEREOF ダイキン工業株式会社 2022-03-31 WO disclosed
US-20200347275-A1 TWO-COMPONENT ADHESIVE EMULSION TECHNOLOGY CO., LTD. (JP) 2020-11-05 US disclosed
EP-3681476-A1 TRANSDERMAL FORMULATIONS Tyme, Inc. (US) 2020-07-22 EP disclosed
CN-111328278-A Transdermal preparation 迪美公司 2020-06-23 CN disclosed
WO-2019055747-A1 TRANSDERMAL FORMULATIONS TYME, INC. (US) 2019-03-21 WO disclosed
US-9458251-B2 Cellulose resin and process for producing the same NEC CORPORATION (JP) 2016-10-04 US disclosed
US-9181351-B2 Cellulose resin and process for producing the same NEC CORPORATION (JP) 2015-11-10 US disclosed
US-20140024824-A1 CELLULOSE RESIN AND PROCESS FOR PRODUCING THE SAME NEC CORPORATION (JP) 2014-01-23 US disclosed
US-20140018530-A1 CELLULOSE RESIN AND PROCESS FOR PRODUCING THE SAME NEC CORPORATION (JP) 2014-01-16 US disclosed