SCHEMBL15434751

SCHEMBL15434751

O=Nc1cccc(N=O)c1Cl

nearest known ligand 0.35

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
S100B P04271 1/20 0.33
ITGB3 P05106 1/20 0.33
ITGAV P06756 1/20 0.33
CYP3A4 P08684 1/20 0.32
TSHR P16473 2/20 0.31
HTR3E A5X5Y0 1/20 0.31
HTR3B O95264 1/20 0.31
HTR3A P46098 1/20 0.31
HTR3D Q70Z44 1/20 0.31
HTR3C Q8WXA8 1/20 0.31
CHRM5 P08912 1/20 0.31
MEN1 O00255 1/20 0.31
ALDH1A1 P00352 1/20 0.31
KMT2A Q03164 1/20 0.31
TDP1 Q9NUW8 1/20 0.31
GALR3 O60755 1/20 0.31
CYP1A2 P05177 1/20 0.30
CYP2A6 P11509 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12463823 0.87 S100B (0.47) S100BITGB3ITGAVCYP3A4TSHR
SCHEMBL28846553 0.83 CYP3A4 (0.35) CYP3A4TSHRMEN1ALDH1A1KMT2A
SCHEMBL11957343 0.79 TDP1 (0.42) TSHRMEN1ALDH1A1KMT2ATDP1
SCHEMBL13681950 0.78 TSHR (0.59) CYP3A4TSHRMEN1ALDH1A1KMT2A
SCHEMBL12809032 0.78 CA12 (0.41) CYP3A4MEN1ALDH1A1KMT2A
SCHEMBL30511829 0.74
SCHEMBL629482 0.74
SCHEMBL11232182 0.74 GRIN2D (0.40) S100BITGB3ITGAVTSHRHTR3E
SCHEMBL30307825 0.74 NPC1 (0.38) CYP3A4TSHRHTR3EHTR3BHTR3A
SCHEMBL234460 0.74 NPC1 (0.38) CYP3A4TSHRHTR3EHTR3BHTR3A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-104781329-B Improved cementing compositions 汉高知识产权控股有限责任公司 2018-11-09 CN claimed
CN-110431177-A Curable composition, in particular as primer for the adhesion of crystalline rubbers to substrates HENKEL AG & CO KGAA 2019-11-08 CN disclosed
CN-104718259-B Improved post cure bonding 洛德公司 2017-08-04 CN disclosed
WO-2014008967-A2 MATERIALS FOR ORGANIC ELECTROLUMINESCENT DEVICES MERCK PATENT GMBH (DE) 2014-01-16 WO disclosed