SCHEMBL1553779

SCHEMBL1553779

COc1cc(-c2cc(OC)c(N)c(C(=O)O)c2)cc(C(=O)O)c1N

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.53
LCK P06239 1/20 0.47
FYN P06241 1/20 0.47
KDM4E B2RXH2 7/20 0.44
HPGD P15428 1/20 0.44
APAF1 O14727 1/20 0.43
RECQL P46063 1/20 0.43
CASP6 P55212 1/20 0.43
CACNA1B Q00975 1/20 0.43
APBA1 Q02410 1/20 0.43
MCL1 Q07820 1/20 0.43
CASP8 Q14790 1/20 0.43
NPC1 O15118 1/20 0.43
MAPK1 P28482 1/20 0.43
RAB9A P51151 1/20 0.43
SMN1; SMN2 Q16637 1/20 0.43
HSD17B10 Q99714 1/20 0.43
GFER P55789 1/20 0.42
KMT2A Q03164 1/20 0.42
RXFP1 Q9HBX9 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5428749 0.85 ALDH1A1 (0.62) ALDH1A1LCKFYNKDM4EHPGD
SCHEMBL10579632 0.83 ALDH1A1 (0.51) ALDH1A1LCKFYNKDM4EHPGD
SCHEMBL10968443 0.83 KDM4E (0.61) ALDH1A1LCKFYNKDM4EHPGD
SCHEMBL953480 0.81 KDM4E (0.56) ALDH1A1LCKFYNKDM4EHPGD
SCHEMBL15845849 0.81 ALDH1A1 (0.50) ALDH1A1LCKFYNKDM4EHPGD
SCHEMBL1319775 0.81 HSD17B10 (0.54) ALDH1A1LCKFYNKDM4EHPGD
SCHEMBL15845864 0.81 ALDH1A1 (0.50) ALDH1A1LCKFYNKDM4EHPGD
Bromide SCHEMBL14358987 0.80 HSD17B10 (0.53) ALDH1A1LCKFYNKDM4EHPGD
SCHEMBL4997223 0.79 KDM4E (0.56) ALDH1A1KDM4EHPGDRECQLCASP6
SCHEMBL16411022 0.78 ALDH1A1 (0.46) ALDH1A1LCKFYNKDM4EHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6875554-B2 Positive photosensitive polyimide resin composition NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2005-04-05 US claimed
CN-119585651-A Composition for forming wavelength conversion film 日产化学株式会社 2025-03-07 CN disclosed
WO-2025047702-A1 COMPOSITION FOR PATTERNING AND USE OF SAME 日産化学株式会社 2025-03-06 WO disclosed
WO-2025047700-A1 COMPOSITION FOR FORMING WAVELENGTH CONVERSION FILM AND USE THEREOF 日産化学株式会社 2025-03-06 WO disclosed
WO-2024214539-A1 COMPOSITION FOR FORMING WAVELENGTH CONVERSION FILM, AND COMPOUND 日産化学株式会社 2024-10-17 WO disclosed
CN-118192168-A Photosensitive resin composition 日产化学株式会社 2024-06-14 CN disclosed
WO-2024122572-A1 WAVELENGTH CONVERSION FILM-FORMING COMPOSITION AND FUSED THIOPHENE COMPOUND 日産化学株式会社 2024-06-13 WO disclosed
CN-110537146-B Photosensitive resin composition 日产化学株式会社 2024-03-15 CN disclosed
CN-110537147-B Photosensitive resin composition 日产化学株式会社 2024-03-12 CN disclosed
WO-2024029475-A1 WAVELENGTH CONVERSION FILM FORMING COMPOSITION 日産化学株式会社 2024-02-08 WO disclosed
US-6875554-B2 Positive photosensitive polyimide resin composition NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2005-04-05 US disclosed
US-20040197699-A1 Positive photosensitive polyimide resin composition NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2004-10-07 US disclosed
EP-1431822-A1 POSITIVE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION Nissan Chemical Industries, Ltd. (JP) 2004-06-23 EP disclosed
US-20040048188-A1 Positive photosensitive polyimide resin composition NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2004-03-11 US disclosed
US-6677099-B1 POLYAMIDEIMIDE DEVELOPED BY AN AQUEOUS ALKALINE SOLUTION AND WHICH IS EXCELLENT IN THE DEVELOPABILITY AND THE ADHESION TO A SUBSTRATE NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2004-01-13 US disclosed
EP-1329769-A1 POSITIVE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION Nissan Chemical Industries, Ltd. (JP) 2003-07-23 EP disclosed
EP-1241527-A1 POSITIVE TYPE PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION Nissan Chemical Industries, Ltd. (JP) 2002-09-18 EP disclosed
EP-0424940-B1 Positive photosensitive polyimide resin composition NISSAN CHEMICAL IND LTD (JP) 1998-01-14 EP disclosed
US-5288588-A Containing diamine substituted with phenolic hydroxyl, carboxyl, thiophenol and/or sulfonic groups NISSAN CHEMICAL INDUSTRIES LTD. (JP) 1994-02-22 US disclosed
EP-0424940-A2 Positive photosensitive polyimide resin composition NISSAN CHEMICAL INDUSTRIES LTD. (JP) 1991-05-02 EP disclosed