SCHEMBL15539

SCHEMBL15539

CCNC(N)=S

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL28322134 0.97
Hydrogen Sulfide SCHEMBL28186607 0.97
Bromide SCHEMBL28323157 0.97
Benzene SCHEMBL28214444 0.91 ALDH1A1 (0.48)
Diethylamine SCHEMBL11624854 0.91 ALDH1A1 (0.48)
SCHEMBL9858739 0.81 ALDH1A1 (0.39)
Thiophene SCHEMBL7021027 0.81 ALDH1A1 (0.39)
SCHEMBL3075815 0.78
SCHEMBL3068584 0.77
SCHEMBL711225 0.75 ALDH1A1 (0.50)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 3001 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3884921-B1 DENTAL POLYMERIZABLE COMPOSITION G C DENTAL IND CORP (JP) 2025-07-02 EP claimed
EP-3884922-B1 DENTAL POLYMERIZABLE COMPOSITION G C DENTAL IND CORP (JP) 2025-06-18 EP claimed
WO-2025086728-A1 COPPER PLATING SOLUTION, METALLIC COPPER LAYER COMPRISING SAME AND USE OF COPPER PLATING SOLUTION 江阴纳力新材料科技有限公司 2025-05-01 WO claimed
CN-119900058-A Copper plating solution, metal copper layer comprising copper plating solution and application of copper plating solution 江阴纳力新材料科技有限公司 2025-04-29 CN claimed
CN-119798537-A Biosensor, biosensor outer film, and preparation method and application of biosensor outer film 上海微创生命科技有限公司 2025-04-11 CN claimed
WO-2025073376-A1 MASKING PREPARATIONS AND COMPOUNDS FROM DAEMONOROPS DRACO (DRAGON BLOOD) SYMRISE AG (DE) 2025-04-10 WO claimed
CN-119307989-A Electrolyte additive, electrolyte, copper foil, preparation method and application of electrolyte additive and copper foil 江西理工大学 2025-01-14 CN claimed
CN-119243226-A Two-dimensional molybdenum-based nano-sheet catalyst and preparation method and application thereof 重庆理工大学 2025-01-03 CN claimed
CN-118993847-A Method for purifying beta-phenethyl alcohol 万华化学集团营养科技有限公司 2024-11-22 CN claimed
CN-113906321-B Polarizing plate, method for manufacturing same, and image display device 住友化学株式会社 2024-10-15 CN claimed
EP-0554275-B1 ACID BATH FOR COPPER PLATING, AND A PROCESS USING A BATH OF THIS TYPE FOR THIS PURPOSE ATOTECH DEUTSCHLAND GMBH (DE) 1994-12-14 EP claimed
US-5236633-A Blend of transparent polymer, thiourea and copper compounds JUJO PAPER CO., LTD. (JP) 1993-08-17 US claimed
US-5147454-A Bath comprising mixture of alkanesulfonic acids or alkanolsulfonic acids, a tin salt thhereof, a lead salt thereof, a thiourea derivative and a mono-, di-, or tricarboxylic acid or salt thereof OKUNO CHEMICAL INDUSTRIES CO., LTD. (JP) 1992-09-15 US claimed
CN-1043575-A IMPROVED ELECTROSTATIC MASTER FOR HIGH SPEED XEROPRINTING DU PONT (US) 1990-07-04 CN claimed
EP-0373533-A2 Improved electrostatic master for high speed xeroprinting E.I. DU PONT DE NEMOURS AND COMPANY (US) 1990-06-20 EP claimed
US-4911999-A Photopolymerizable composition of ethylenically unsaturated monomer, organic binder and photoinitiator E. I. DU PONT DE NEMOURS AND COMPANY (US) 1990-03-27 US claimed
US-4627968-A Synthesis of crystalline aluminosilicate with alkylurea or alkylthiourea ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1986-12-09 US claimed
US-4264710-A AN ETHYLENICALLY UNSATURATED COMPOUND, AND A PHOTOPOLYMERIZATION INIATOR FUJI PHOTO FILM CO., LTD. (JP) 1981-04-28 US claimed
US-4177072-A HYDROPHILIC AND OLEOPHILIC AREAS FUJI PHOTO FILM CO., LTD. (JP) 1979-12-04 US claimed
US-4083899-A Accelerated process of alcoholysis or phenolysis of phosporus pentasulfide PRODUITS CHIMIQUES UGINE KUHLMANN (FR) 1978-04-11 US claimed