SCHEMBL15580873

SCHEMBL15580873

CC(=O)c1ccc2cc(OC(=O)c3ccc4cc(N)ccc4c3)ccc2c1

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HGFAC Q04756 2/20 0.51
NR1H4 Q96RI1 1/20 0.48
KMT2A Q03164 7/20 0.47
MAPT P10636 4/20 0.47
MEN1 O00255 3/20 0.47
TDP1 Q9NUW8 1/20 0.47
F2 P00734 3/20 0.46
PRSS1 P07477 3/20 0.46
ALDH1A1 P00352 2/20 0.46
TMPRSS2 O15393 1/20 0.46
MLNR O43193 1/20 0.46
C1R P00736 1/20 0.46
F10 P00742 1/20 0.46
PLG P00747 1/20 0.46
F12 P00748 1/20 0.46
LMNA P02545 1/20 0.46
ITGB3 P05106 1/20 0.46
HPN P05981 1/20 0.46
KLK1 P06870 1/20 0.46
CHRM2 P08172 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12268693 0.95 HGFAC (0.50) HGFACNR1H4KMT2AMAPTMEN1
SCHEMBL12268808 0.86 KMT2A (0.50) HGFACNR1H4KMT2AMAPTMEN1
SCHEMBL10151636 0.85 CYP2A6 (0.55) KMT2AMAPTMEN1TDP1ALDH1A1
SCHEMBL24141857 0.84 KMT2A (0.68) HGFACKMT2AMAPTMEN1TDP1
SCHEMBL14579680 0.84 KDM4E (0.60) HGFACKMT2AMAPTMEN1TDP1
SCHEMBL14884426 0.83 KMT2A (0.62) HGFACKMT2AMAPTMEN1TDP1
SCHEMBL15031563 0.83 CYP2A6 (0.65) HGFACKMT2AMAPTMEN1TDP1
SCHEMBL12895866 0.82 MAPT (0.55) HGFACKMT2AMAPTMEN1TDP1
SCHEMBL9788371 0.82 F2 (0.58) HGFACNR1H4KMT2AMAPTMEN1
SCHEMBL14579682 0.82 KMT2A (0.63) HGFACKMT2AMAPTMEN1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8822832-B2 Epoxy resin composition for printed circuit board, insulating film, prepreg, and multilayer printed circuit board SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2014-09-02 US disclosed
US-20140077129-A1 EPOXY RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2014-03-20 US disclosed