SCHEMBL12268693

SCHEMBL12268693

CC(=O)c1ccc(OC(=O)c2ccc3cc(OC(=O)c4ccc5cc(N)ccc5c4)ccc3c2)cc1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HGFAC Q04756 2/20 0.50
NR1H4 Q96RI1 1/20 0.47
KMT2A Q03164 7/20 0.46
MAPT P10636 5/20 0.46
TDP1 Q9NUW8 2/20 0.46
MEN1 O00255 2/20 0.46
F2 P00734 3/20 0.45
PRSS1 P07477 3/20 0.45
TMPRSS2 O15393 1/20 0.45
MLNR O43193 1/20 0.45
ALDH1A1 P00352 1/20 0.45
C1R P00736 1/20 0.45
F10 P00742 1/20 0.45
PLG P00747 1/20 0.45
F12 P00748 1/20 0.45
LMNA P02545 1/20 0.45
ITGB3 P05106 1/20 0.45
HPN P05981 1/20 0.45
KLK1 P06870 1/20 0.45
CHRM2 P08172 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15580873 0.95 HGFAC (0.51) HGFACNR1H4KMT2AMAPTTDP1
SCHEMBL12268808 0.90 KMT2A (0.50) HGFACNR1H4KMT2AMAPTTDP1
SCHEMBL12268652 0.86 MAPT (0.51) HGFACKMT2AMAPTTDP1MEN1
SCHEMBL15462343 0.86 MAPT (0.51) HGFACKMT2AMAPTTDP1MEN1
SCHEMBL12268536 0.85 KDM4E (0.58) HGFACKMT2AMAPTTDP1MEN1
SCHEMBL12895866 0.84 MAPT (0.55) HGFACKMT2AMAPTTDP1MEN1
SCHEMBL9788371 0.84 F2 (0.58) HGFACNR1H4KMT2AMAPTTDP1
SCHEMBL12268648 0.84 KMT2A (0.60) HGFACKMT2AMAPTTDP1MEN1
SCHEMBL2742859 0.83 KMT2A (0.64) HGFACKMT2AMAPTTDP1MEN1
SCHEMBL4326711 0.81 MAPT (0.60) KMT2AMAPTTDP1MEN1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8784682-B2 Thermosetting composition and printed circuit board using the same SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2014-07-22 US disclosed
US-20110235292-A1 THERMOSETTING COMPOSITION AND PRINTED CIRCUIT BOARD USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2011-09-29 US disclosed