SCHEMBL15723346

SCHEMBL15723346

CC(CCCCCCCS(=O)(=O)O)COc1ccc2ccccc2c1

nearest known ligand 0.45

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
▸ RAB9A P51151 4/20 0.41
▸ NPC1 O15118 1/20 0.41
▸ PTPN7 P35236 1/20 0.40
▸ KDM1A O60341 2/20 0.40
▸ RECQL P46063 1/20 0.40
▸ HDAC1 Q13547 1/20 0.40
▸ SMN1; SMN2 Q16637 1/20 0.39
▸ PPARG P37231 2/20 0.39
▸ PPARA Q07869 2/20 0.39
▸ GPBAR1 Q8TDU6 1/20 0.38
▸ AGXT P21549 1/20 0.38
▸ GAA P10253 1/20 0.38
▸ MAPK1 P28482 1/20 0.38
▸ TDP1 Q9NUW8 1/20 0.38
▸ L3MBTL1 Q9Y468 1/20 0.38
▸ KDM4E B2RXH2 1/20 0.38
▸ ALDH1A1 P00352 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15723349 0.81 CETP (0.47) RAB9ANPC1KDM1ARECQLSMN1; SMN2
SCHEMBL15726984 0.78 KDM4E (0.56) RAB9ANPC1PTPN7HDAC1SMN1; SMN2
SCHEMBL15863713 0.78 KDM1A (0.50) RAB9APTPN7KDM1ASMN1; SMN2MAPK1
SCHEMBL18084874 0.76 KDM4E (0.46) RAB9ANPC1PTPN7KDM1ARECQL
SCHEMBL31032843 0.73 AGXT (0.50) RAB9ANPC1PTPN7KDM1ARECQL
SCHEMBL18775628 0.73 KDM4E (0.58) RAB9ANPC1PTPN7HDAC1SMN1; SMN2
SCHEMBL31032706 0.73 AGXT (0.50) RAB9ANPC1PTPN7KDM1ARECQL
SCHEMBL15870447 0.73 AGXT (0.44) RAB9ANPC1PTPN7KDM1ARECQL
SCHEMBL6674906 0.72 RAB9A (0.47) RAB9ANPC1PTPN7KDM1ARECQL
SCHEMBL20110894 0.72 KDM4E (0.66) RAB9ANPC1PTPN7HDAC1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10021782-B2 Composition and method for the deposition of conductive polymers on dielectric substrates CITIBANK, N.A. 2018-07-10 — — US disclosed
US-20180002541-A1 Compositions Including a High Molecular Weight Acid Suitable for Conductive Polymer Formation on Dielectric Substrate MACDERMID ENTHONE INC (US) 2018-01-04 — — US disclosed
US-20140138253-A1 COMPOSITION AND METHOD FOR THE DEPOSITION OF CONDUCTIVE POLYMERS ON DIELECTRIC SUBSTRATES ENTHONE INC. (US) 2014-05-22 — — US disclosed
Send feedback