SCHEMBL15760481

SCHEMBL15760481

Cc1ccc(OC(=O)c2ccc3cc(OC(=O)c4ccc5cc(O)ccc5c4)ccc3c2)cc1

nearest known ligand 0.83

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 12/20 0.68
ESR1 P03372 6/20 0.68
MEN1 O00255 8/20 0.59
CASP3 P42574 2/20 0.59
SENP8 Q96LD8 2/20 0.59
SENP7 Q9BQF6 2/20 0.59
SENP6 Q9GZR1 2/20 0.59
NPC1 O15118 2/20 0.55
GBA1 P04062 1/20 0.53
RAB9A P51151 1/20 0.52
SMN1; SMN2 Q16637 1/20 0.52
RXFP1 Q9HBX9 1/20 0.52
ALDH1A1 P00352 2/20 0.50
HGFAC Q04756 1/20 0.48
ESR2 Q92731 4/20 0.48
PKM P14618 1/20 0.48
PRSS1 P07477 1/20 0.48
ACR P10323 1/20 0.48
MAPT P10636 1/20 0.47
TDP1 Q9NUW8 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14996380 0.97 KMT2A (0.63) KMT2AESR1MEN1CASP3SENP8
SCHEMBL12281293 0.94 KMT2A (0.72) KMT2AESR1MEN1CASP3SENP8
SCHEMBL14403876 0.92 KMT2A (0.66) KMT2AESR1MEN1CASP3SENP8
SCHEMBL28009502 0.91 KMT2A (0.72) KMT2AESR1MEN1CASP3SENP8
SCHEMBL12417278 0.91 KMT2A (0.62) KMT2AESR1MEN1NPC1GBA1
SCHEMBL23386312 0.91 KMT2A (0.66) KMT2AESR1MEN1CASP3SENP8
SCHEMBL12859553 0.91 KMT2A (0.66) KMT2AESR1MEN1CASP3SENP8
SCHEMBL16521504 0.89 KMT2A (0.57) KMT2AESR1MEN1NPC1GBA1
SCHEMBL777641 0.89 KMT2A (0.59) KMT2AESR1MEN1CASP3SENP8
SCHEMBL21186189 0.89 KMT2A (0.61) KMT2AESR1MEN1NPC1GBA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20150065608-A1 INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRODUCTS MANUFACTURED BY USING THE SAME SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2015-03-05 US disclosed
US-20150057393-A1 INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRODUCTS MANUFACTURED BY USING THE SAME SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2015-02-26 US disclosed
US-20140187679-A1 RESIN COMPOSITION WITH GOOD WORKABILITY, INSULATING FILM, AND PREPREG SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2014-07-03 US disclosed
US-20140154479-A1 RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG AND PRINTED CIRCUIT BOARD SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2014-06-05 US disclosed