⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15785139 | 0.82 | — | — | |
| SCHEMBL27851920 | 0.76 | — | — | |
| SCHEMBL27851827 | 0.73 | — | — | |
| SCHEMBL28576039 | 0.73 | — | — | |
| SCHEMBL5014095 | 0.69 | — | — | |
| SCHEMBL15135116 | 0.69 | LMNA (0.30) | — | |
| SCHEMBL15135200 | 0.69 | — | — | |
| SCHEMBL28991503 | 0.69 | — | — | |
| SCHEMBL28991950 | 0.67 | — | — | |
| SCHEMBL15135120 | 0.66 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250188609-A1 | SEAM-FREE AND CRACK-FREE DEPOSITION | LAM RES CORP (US) | 2025-06-12 | — | — | US | disclosed |
| US-20250054747-A1 | CONFORMAL DEPOSITION OF SILICON NITRIDE | LAM RES CORP (US) | 2025-02-13 | — | — | US | disclosed |
| US-20250038003-A1 | LOW TEMPERATURE MOLYBDENUM DEPOSITION ASSISTED BY SILICON-CONTAINING REACTANTS | LAM RESEARCH CORPORATION (US) | 2025-01-30 | — | — | US | disclosed |
| US-20250014890-A1 | CONFORMAL, CARBON-DOPED SILICON NITRIDE FILMS AND METHODS THEREOF | LAM RESEARCH CORPORATION | 2025-01-09 | — | — | US | disclosed |
| CN-119213529-A | Seamless and crack-free deposition | 朗姆研究公司 | 2024-12-27 | — | — | CN | disclosed |
| WO-2024243002-A1 | LOW PRESSURE CHEMICAL VAPOR DEPOSITION OF SILICON OXIDE | LAM RESEARCH CORPORATION (US) | 2024-11-28 | — | — | WO | disclosed |
| CN-118402040-A | Low temperature molybdenum deposition assisted by silicon-containing reactants | 朗姆研究公司 | 2024-07-26 | — | — | CN | disclosed |
| CN-118402039-A | Conformal deposition of silicon nitride | 朗姆研究公司 | 2024-07-26 | — | — | CN | disclosed |
| CN-118355473-A | Conformal carbon-doped silicon nitride films and methods thereof | 朗姆研究公司 | 2024-07-16 | — | — | CN | disclosed |
| US-20240030062-A1 | INTEGRATION OF FULLY ALIGNED VIA THROUGH SELECTIVE DEPOSITION AND RESISTIVITY REDUCTION | LAM RESEARCH CORPORATION | 2024-01-25 | — | — | US | disclosed |
| WO-2023114641-A1 | CONFORMAL DEPOSITION OF SILICON NITRIDE | LAM RESEARCH CORPORATION (US) | 2023-06-22 | — | — | WO | disclosed |
| WO-2023102440-A1 | CONFORMAL, CARBON-DOPED SILICON NITRIDE FILMS AND METHODS THEREOF | LAM RESEARCH CORPORATION (US) | 2023-06-08 | — | — | WO | disclosed |
| WO-2022221881-A1 | INTEGRATION OF FULLY ALIGNED VIA THROUGH SELECTIVE DEPOSITION AND RESISTIVITY REDUCTION | LAM RESEARCH CORPORATION (US) | 2022-10-20 | — | — | WO | disclosed |
| CN-114466903-A | Organosilicon-based products and their use | 美国陶氏有机硅公司 | 2022-05-10 | — | — | CN | disclosed |
| US-10899500-B2 | Alkoxysilylamine compounds and applications thereof | VERSUM MATERIALS US, LLC (US) | 2021-01-26 | — | — | US | disclosed |
| US-20190225377-A1 | Alkoxysilylamine Compounds and Applications Thereof | VERSUM MATERIALS US, LLC (US) | 2019-07-25 | — | — | US | disclosed |
| US-10279959-B2 | Alkoxysilylamine compounds and applications thereof | VERSUM MATERIALS US, LLC (US) | 2019-05-07 | — | — | US | disclosed |
| EP-2743272-B1 | Alkoxysilylamine compounds and applications thereof | AIR PROD & CHEM (US) | 2016-11-02 | — | — | EP | disclosed |
| EP-2743272-A1 | Alkoxysilylamine compounds and applications thereof | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2014-06-18 | — | — | EP | disclosed |
| US-20140158580-A1 | ALKOXYSILYLAMINE COMPOUNDS AND APPLICATIONS THEREOF | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2014-06-12 | — | — | US | disclosed |