⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL346429 | 0.78 | — | — | |
| SCHEMBL19460311 | 0.78 | KDM4E (0.39) | — | |
| Urea SCHEMBL3126400 | 0.75 | ALOX15 (0.48) | — | |
| SCHEMBL11727485 | 0.75 | — | — | |
| Carbamic Acid SCHEMBL1902701 | 0.73 | ALOX15 (0.46) | — | |
| SCHEMBL11841196 | 0.73 | — | — | |
| SCHEMBL1715036 | 0.73 | — | — | |
| SCHEMBL3969005 | 0.71 | — | — | |
| Hydrochloric Acid SCHEMBL9760071 | 0.71 | — | — | |
| SCHEMBL1164799 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114583096-B | Electrode plate and secondary battery thereof | 深圳市研一新材料有限责任公司 | 2024-03-22 | — | — | CN | claimed |
| CN-115986312-A | Functional composition, battery diaphragm containing functional composition and preparation method of battery diaphragm | 深圳市研一新材料有限责任公司 | 2023-04-18 | — | — | CN | claimed |
| CN-115832310-A | Binder and preparation method thereof, electrode plate and secondary battery | 深圳市研一新材料有限责任公司 | 2023-03-21 | — | — | CN | claimed |
| CN-114583096-A | Electrode plate and secondary battery thereof | 深圳市研一新材料有限责任公司 | 2022-06-03 | — | — | CN | claimed |
| US-20100239858-A1 | FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING SAME | HITACHI CHEMICAL CO., LTD., (JP) | 2010-09-23 | — | — | US | claimed |
| EP-2053108-A1 | FILM ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING THE SAME | Hitachi Chemical Co., Ltd. (JP) | 2009-04-29 | — | — | EP | claimed |
| CN-114583096-B | Electrode plate and secondary battery thereof | 深圳市研一新材料有限责任公司 | 2024-03-22 | — | — | CN | disclosed |
| EP-4328963-A1 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE | Resonac Corporation (JP) | 2024-02-28 | — | — | EP | disclosed |
| WO-2023232162-A1 | BINDER AND PREPARATION METHOD THEREFOR, ELECTRODE PLATE AND SECONDARY BATTERY | 深圳市研一新材料有限责任公司 | 2023-12-07 | — | — | WO | disclosed |
| CN-219534554-U | Electrode plate and battery comprising same | 珠海冠宇电池股份有限公司 | 2023-08-15 | — | — | CN | disclosed |
| CN-110582726-B | Positive photosensitive resin composition, thermal crosslinking agent for positive photosensitive resin, pattern cured film, method for producing pattern cured film, semiconductor element, and electronic device | 株式会社力森诺科 | 2023-08-04 | — | — | CN | disclosed |
| CN-115986312-A | Functional composition, battery diaphragm containing functional composition and preparation method of battery diaphragm | 深圳市研一新材料有限责任公司 | 2023-04-18 | — | — | CN | disclosed |
| CN-115832310-A | Binder and preparation method thereof, electrode plate and secondary battery | 深圳市研一新材料有限责任公司 | 2023-03-21 | — | — | CN | disclosed |
| EP-2151715-A1 | PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, METHOD FOR FORMING ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Hitachi Chemical Company, Ltd. (JP) | 2010-02-10 | — | — | EP | disclosed |
| EP-2135910-A1 | PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | Hitachi Chemical Company, Ltd. (JP) | 2009-12-23 | — | — | EP | disclosed |
| CN-101501153-A | Film adhesive, adhesive sheet, and semiconductor device using the same | HITACHI CHEMICAL CO LTD (JP) | 2009-08-05 | — | — | CN | disclosed |
| EP-2053108-A1 | FILM ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING THE SAME | Hitachi Chemical Co., Ltd. (JP) | 2009-04-29 | — | — | EP | disclosed |
| EP-2053108-A1 | FILM ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING THE SAME | Hitachi Chemical Co., Ltd. (JP) | 2009-04-29 | — | — | EP | disclosed |
| WO-2008015759-A1 | FILM ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE USING THE SAME | HITACHI CHEMICAL CO., LTD. (JP) | 2008-02-07 | — | — | WO | disclosed |
| JP-2006225566-A | FILM-LIKE ADHESIVE, ADHESIVE SHEET AND SEMICONDUCTOR DEVICE USING THE SAME | HITACHI CHEM CO LTD | 2006-08-31 | — | — | JP | disclosed |