SCHEMBL1594982

SCHEMBL1594982

COc1cc(C(CC(c2ccc(O)c(OC)c2)c2ccc(O)c(OC)c2)c2ccc(O)c(OC)c2)ccc1O

nearest known ligand 0.64

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
BCHE P06276 2/20 0.64
TYR P14679 2/20 0.64
ACHE P22303 2/20 0.64
TSHR P16473 3/20 0.64
CYP3A4 P08684 1/20 0.64
BLM P54132 2/20 0.62
NFKB1 P19838 2/20 0.62
NPSR1 Q6W5P4 1/20 0.62
PMP22 Q01453 1/20 0.60
SLC22A3 O75751 1/20 0.55
GAA P10253 3/20 0.55
MAOB P27338 1/20 0.53
PDE4D Q08499 1/20 0.52
FOS P01100 1/20 0.51
TTR P02766 1/20 0.51
JUN P05412 1/20 0.51
NR3C1 P04150 1/20 0.51
HSD17B1 P14061 1/20 0.51
HSD17B2 P37059 1/20 0.51
FOLH1 Q04609 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30343469 1.00 BCHE (0.64) BCHETYRACHETSHRCYP3A4
SCHEMBL1595318 0.89 BCHE (0.64) BCHETYRACHETSHRCYP3A4
SCHEMBL30491037 0.89 BCHE (0.73) BCHETYRACHETSHRCYP3A4
SCHEMBL30343445 0.89 BCHE (0.64) BCHETYRACHETSHRCYP3A4
SCHEMBL5072122 0.89 BCHE (0.73) BCHETYRACHETSHRCYP3A4
SCHEMBL1595201 0.85 BCHE (0.60) BCHETYRACHETSHRCYP3A4
SCHEMBL16991795 0.84 TSHR (0.63) BCHETYRACHETSHRCYP3A4
SCHEMBL11606067 0.84 BCHE (0.63) BCHETYRACHETSHRCYP3A4
SCHEMBL1595549 0.82 TSHR (0.65) BCHETYRACHETSHRCYP3A4
SCHEMBL20563424 0.82 TSHR (0.65) BCHETYRACHETSHRCYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 60 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12187843-B2 Liquid compression molding or encapsulant compositions HENKEL AG & CO. KGAA (DE) 2025-01-07 US disclosed
US-20240301129-A1 LIQUID MOLD COMPOUNDS, REACTION PRODUCTS OF WHICH BECOME PLATABLE UPON EXPOSURE TO LASER ENERGY HENKEL AG & CO KGAA (DE) 2024-09-12 US disclosed
WO-2023091578-A1 LIQUID MOLD COMPOUNDS, REACTION PRODUCTS OF WHICH BECOME PLATABLE UPON EXPOSURE TO LASER ENERGY HENKEL AG & CO. KGAA (DE) 2023-05-25 WO disclosed
EP-3230339-B1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES (JP) 2022-03-23 EP disclosed
US-20210163674-A1 LIQUID COMPRESSION MOLDING OR ENCAPSULANT COMPOSITIONS Henkel IP & Holding GmbH (DE) 2021-06-03 US disclosed
US-10851201-B2 Curing agent for thermosetting epoxy resins, and a process for the preparation of insulation systems for electrical engineering HUNTSMAN INTERNATIONAL LLC (US) 2020-12-01 US disclosed
EP-3298061-B1 A CURING AGENT FOR THERMOSETTING EPOXY RESINS, AND A PROCESS FOR THE PREPARATION OF INSULATION SYSTEMS FOR ELECTRICAL ENGINEERING HUNTSMAN ADVANCED MAT LICENSING (SWITZERLAND) GMBH (CH) 2020-09-09 EP disclosed
US-20180142058-A1 A Curing Agent For Thermosetting Epoxy Resins, and a Process for the Preparation of Insulation Systems for Electrical Engineering HUNTSMAN INTERNATIONAL LLC (US) 2018-05-24 US disclosed
US-20170362376-A1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL TORAY INDUSTRIES, INC. (JP) 2017-12-21 US disclosed
EP-3230339-A1 EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL Toray Industries, Inc. (JP) 2017-10-18 EP disclosed
EP-1342706-A1 METHOD FOR PRODUCING MOLECULAR COMPOUND NIPPON SODA CO., LTD. (JP) 2003-09-10 EP disclosed
US-6528467-B1 Clathrates such as 5-chloro-2-methyl-4-isothiazolin-3-one and pressure molded 1,1-bis(4-hydroxyphenyl)cyclohexane host compounds, used for unclogging drains NIPPON SODA CO., LTD. (JP) 2003-03-04 US disclosed
US-20030032569-A1 Slime remover and slime preventing/removing agent NIPPON SODA CO., LTD. 2003-02-13 US disclosed
US-20020193528-A1 Molecular compound comprising polymer having hydrogen bond as component compound NIPPON SODA CO., LTD. (JP) 2002-12-19 US disclosed
EP-1241230-A1 MOLECULAR COMPOUND COMPRISING POLYMER HAVING HYDROGEN BOND AS COMPONENT COMPOUND NIPPON SODA CO., LTD. (JP) 2002-09-18 EP disclosed
EP-1113112-A1 SLIME REMOVER AND SLIME PREVENTING/REMOVING AGENT NIPPON SODA CO., LTD. (JP) 2001-07-04 EP disclosed
EP-0949286-A1 CURATIVES FOR EPOXY RESIN, CURING ACCELERATOR, AND EPOXY RESIN COMPOSITION NIPPON SODA CO., LTD. (JP) 1999-10-13 EP disclosed
EP-0589044-B1 NOVEL INCLUSION COMPOUND COMPRISING TETRAKISPHENOL AS HOST NIPPON SODA CO (JP) 1996-10-23 EP disclosed
US-5364977-A Chemical stabilization and powder processing NIPPON SODA CO., LTD. (JP) 1994-11-15 US disclosed
EP-0589044-A1 NOVEL INCLUSION COMPOUND COMPRISING TETRAKISPHENOL AS HOST NIPPON SODA CO., LTD. (JP) 1994-03-30 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20020193528-A1 Molecular compound comprising polymer having hydrogen bond as component compound PIEZO1, PARN, PARG BCHE 2048/4885TYR 1299/4885ACHE 4134/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.