SCHEMBL15965784

SCHEMBL15965784

CCCCCCCCCCCCOc1ccc(CCN2C(=O)c3ccc4c5ccc6c7c(ccc(c8ccc(c3c48)C2=O)c75)C(=O)N(CCc2ccc(C)cc2)C6=O)cc1

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HPGD P15428 2/20 0.49
NPSR1 Q6W5P4 1/20 0.49
CNR2 P34972 1/20 0.47
STAT3 P40763 1/20 0.43
HIF1A Q16665 1/20 0.43
CA1 P00915 1/20 0.42
CA2 P00918 1/20 0.42
CA4 P22748 1/20 0.42
CA9 Q16790 1/20 0.42
TERT O14746 2/20 0.41
MAPT P10636 2/20 0.41
MEN1 O00255 1/20 0.41
ALDH1A1 P00352 1/20 0.41
POLB P06746 1/20 0.41
KMT2A Q03164 1/20 0.41
RAB9A P51151 3/20 0.40
NPC1 O15118 1/20 0.40
TP53 P04637 1/20 0.40
SMN1; SMN2 Q16637 1/20 0.40
SPHK2 Q9NRA0 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12780472 0.90 HPGD (0.44) HPGDNPSR1CNR2STAT3HIF1A
SCHEMBL14309276 0.83 TERT (0.56) STAT3HIF1ACA1CA2CA4
SCHEMBL12780370 0.80 HPGD (0.39) HPGDNPSR1CNR2STAT3HIF1A
SCHEMBL12431371 0.78 CA1 (0.61) CA1CA2CA4CA9TERT
SCHEMBL8085081 0.76 CNR2 (0.62) CNR2CA1CA2CA4CA9
SCHEMBL10004510 0.76 STAT3 (0.56) NPSR1STAT3HIF1ATERTMAPT
SCHEMBL11923437 0.76 STAT3 (0.56) NPSR1STAT3HIF1ATERTMAPT
SCHEMBL11923436 0.76 STAT3 (0.56) NPSR1STAT3HIF1ATERTMAPT
SCHEMBL14524634 0.76 TERT (0.56) HPGDSTAT3HIF1ACA1CA2
SCHEMBL1105114 0.75 STAT3 (0.65) NPSR1STAT3HIF1ATERTMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20160013392-A1 METHOD OF PRODUCING THERMOELECTRIC CONVERSION ELEMENT AND METHOD OF PREPARATION DISPERSION FOR THERMOELECTRIC CONVERSION LAYER FUJIFILM CORPORATION (JP) 2016-01-14 US disclosed
US-20140251407-A1 THERMOELECTRIC CONVERSION MATERIAL AND A THERMOELECTRIC CONVERSION ELEMENT FUJIFILM CORPORATION (JP) 2014-09-11 US disclosed
US-20140230871-A1 THERMOELECTRIC CONVERSION MATERIAL AND THERMOELECTRIC CONVERSION ELEMENT FUJIFILM CORPORATION (JP) 2014-08-21 US disclosed