SCHEMBL15965794

SCHEMBL15965794

CCCCC(CC)CC1(CC(CC)CCCC)c2cc(C)sc2-c2sc(-c3ccc(-c4ccc(-c5ccc(C)s5)c5nsnc45)s3)cc21

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL25622081 0.98 — —
SCHEMBL14589600 0.89 — —
SCHEMBL2610169 0.89 — —
SCHEMBL25451008 0.86 ALDH1A1 (0.32) —
SCHEMBL21608689 0.85 — —
SCHEMBL11913493 0.85 — —
SCHEMBL23430056 0.85 SMN1; SMN2 (0.30) —
SCHEMBL14123528 0.84 — —
SCHEMBL12119465 0.84 — —
SCHEMBL25622690 0.83 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20160013392-A1 METHOD OF PRODUCING THERMOELECTRIC CONVERSION ELEMENT AND METHOD OF PREPARATION DISPERSION FOR THERMOELECTRIC CONVERSION LAYER FUJIFILM CORPORATION (JP) 2016-01-14 — — US disclosed
US-20140251407-A1 THERMOELECTRIC CONVERSION MATERIAL AND A THERMOELECTRIC CONVERSION ELEMENT FUJIFILM CORPORATION (JP) 2014-09-11 — — US disclosed
US-20140230871-A1 THERMOELECTRIC CONVERSION MATERIAL AND THERMOELECTRIC CONVERSION ELEMENT FUJIFILM CORPORATION (JP) 2014-08-21 — — US disclosed
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