Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 | P00915 | 1/20 | 0.48 |
| ▸ | CA2 | P00918 | 1/20 | 0.48 |
| ▸ | ESR1 | P03372 | 2/20 | 0.43 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.43 |
| ▸ | PTGS1 | P23219 | 7/20 | 0.39 |
| ▸ | PTGS2 | P35354 | 7/20 | 0.39 |
| ▸ | ALOX5 | P09917 | 3/20 | 0.39 |
| ▸ | TTR | P02766 | 1/20 | 0.39 |
| ▸ | HMGB1 | P09429 | 1/20 | 0.36 |
| ▸ | CXCL12 | P48061 | 1/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.36 |
| ▸ | GAA | P10253 | 2/20 | 0.34 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.34 |
| ▸ | LMNA | P02545 | 1/20 | 0.34 |
| ▸ | MAPT | P10636 | 1/20 | 0.34 |
| ▸ | MEN1 | O00255 | 3/20 | 0.34 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.34 |
| ▸ | ACHE | P22303 | 1/20 | 0.34 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.34 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL26985313 | 0.89 | CA1 (0.42) | CA1CA2ESR1ESR2PTGS1 | |
| SCHEMBL9429452 | 0.87 | CA1 (0.41) | CA1CA2ESR1ESR2PTGS1 | |
| SCHEMBL1596134 | 0.85 | CA1 (0.48) | CA1CA2ESR1ESR2PTGS1 | |
| SCHEMBL27982653 | 0.83 | ESR1 (0.39) | CA1CA2ESR1ESR2PTGS1 | |
| SCHEMBL2570936 | 0.83 | ESR1 (0.46) | CA1CA2ESR1ESR2PTGS1 | |
| SCHEMBL11353335 | 0.81 | CA1 (0.44) | CA1CA2ESR1ESR2PTGS1 | |
| SCHEMBL11345680 | 0.81 | CA1 (0.44) | CA1CA2ESR1ESR2PTGS1 | |
| SCHEMBL1597151 | 0.81 | CA1 (0.44) | CA1CA2ESR1ESR2PTGS1 | |
| SCHEMBL11348402 | 0.81 | CA1 (0.44) | CA1CA2ESR1ESR2PTGS1 | |
| SCHEMBL28081375 | 0.80 | ESR1 (0.37) | CA1CA2ESR1ESR2PTGS1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 76 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12187843-B2 | Liquid compression molding or encapsulant compositions | HENKEL AG & CO. KGAA (DE) | 2025-01-07 | — | — | US | disclosed |
| US-20240301129-A1 | LIQUID MOLD COMPOUNDS, REACTION PRODUCTS OF WHICH BECOME PLATABLE UPON EXPOSURE TO LASER ENERGY | HENKEL AG & CO KGAA (DE) | 2024-09-12 | — | — | US | disclosed |
| WO-2023091578-A1 | LIQUID MOLD COMPOUNDS, REACTION PRODUCTS OF WHICH BECOME PLATABLE UPON EXPOSURE TO LASER ENERGY | HENKEL AG & CO. KGAA (DE) | 2023-05-25 | — | — | WO | disclosed |
| EP-3230339-B1 | EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL | TORAY INDUSTRIES (JP) | 2022-03-23 | — | — | EP | disclosed |
| US-20210163674-A1 | LIQUID COMPRESSION MOLDING OR ENCAPSULANT COMPOSITIONS | Henkel IP & Holding GmbH (DE) | 2021-06-03 | — | — | US | disclosed |
| US-10851201-B2 | Curing agent for thermosetting epoxy resins, and a process for the preparation of insulation systems for electrical engineering | HUNTSMAN INTERNATIONAL LLC (US) | 2020-12-01 | — | — | US | disclosed |
| EP-3298061-B1 | A CURING AGENT FOR THERMOSETTING EPOXY RESINS, AND A PROCESS FOR THE PREPARATION OF INSULATION SYSTEMS FOR ELECTRICAL ENGINEERING | HUNTSMAN ADVANCED MAT LICENSING (SWITZERLAND) GMBH (CH) | 2020-09-09 | — | — | EP | disclosed |
| CN-107001594-B | Composition epoxy resin, prepreg, the manufacturing method of fiber reinforced plastic materials and fiber reinforced plastic materials | 东丽株式会社 | 2019-07-23 | — | — | CN | disclosed |
| US-20180142058-A1 | A Curing Agent For Thermosetting Epoxy Resins, and a Process for the Preparation of Insulation Systems for Electrical Engineering | HUNTSMAN INTERNATIONAL LLC (US) | 2018-05-24 | — | — | US | disclosed |
| CN-107636039-A | Curing agent and the method for preparing insulation system for electronic engineering for thermosetting epoxy resin | 亨斯迈先进材料许可(瑞士)有限公司 | 2018-01-26 | — | — | CN | disclosed |
| US-6528467-B1 | Clathrates such as 5-chloro-2-methyl-4-isothiazolin-3-one and pressure molded 1,1-bis(4-hydroxyphenyl)cyclohexane host compounds, used for unclogging drains | NIPPON SODA CO., LTD. (JP) | 2003-03-04 | — | — | US | disclosed |
| US-20030032569-A1 | Slime remover and slime preventing/removing agent | NIPPON SODA CO., LTD. | 2003-02-13 | — | — | US | disclosed |
| US-20020193528-A1 | Molecular compound comprising polymer having hydrogen bond as component compound | NIPPON SODA CO., LTD. (JP) | 2002-12-19 | — | — | US | disclosed |
| EP-1241230-A1 | MOLECULAR COMPOUND COMPRISING POLYMER HAVING HYDROGEN BOND AS COMPONENT COMPOUND | NIPPON SODA CO., LTD. (JP) | 2002-09-18 | — | — | EP | disclosed |
| EP-1113112-A1 | SLIME REMOVER AND SLIME PREVENTING/REMOVING AGENT | NIPPON SODA CO., LTD. (JP) | 2001-07-04 | — | — | EP | disclosed |
| US-6147169-A | LOW TEMPERATURE CURING MIXTURE OF REACTIVE BASE RESIN AND A CLATHRATE COMPRISING A TETRAKISPHENOL HOSTING A CURING AGENT OR CURING CATALYST; STORAGE STABILITY, CORROSION RESISTANCE, ADHESION | KANSAI PAINT CO., LTD. (JP) | 2000-11-14 | — | — | US | disclosed |
| EP-0949286-A1 | CURATIVES FOR EPOXY RESIN, CURING ACCELERATOR, AND EPOXY RESIN COMPOSITION | NIPPON SODA CO., LTD. (JP) | 1999-10-13 | — | — | EP | disclosed |
| EP-0589044-B1 | NOVEL INCLUSION COMPOUND COMPRISING TETRAKISPHENOL AS HOST | NIPPON SODA CO (JP) | 1996-10-23 | — | — | EP | disclosed |
| US-5364977-A | Chemical stabilization and powder processing | NIPPON SODA CO., LTD. (JP) | 1994-11-15 | — | — | US | disclosed |
| EP-0589044-A1 | NOVEL INCLUSION COMPOUND COMPRISING TETRAKISPHENOL AS HOST | NIPPON SODA CO., LTD. (JP) | 1994-03-30 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20020193528-A1 | Molecular compound comprising polymer having hydrogen bond as component compound | PIEZO1, PARN, PARG | CA1 2814/4885CA2 1953/4885ESR1 1071/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.