⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Butadiene SCHEMBL3861043 | 1.00 | — | — | |
| Butadiene SCHEMBL21990267 | 0.83 | TSHR (0.32) | — | |
| Butadiene SCHEMBL1086689 | 0.82 | — | — | |
| Propene SCHEMBL1095309 | 0.82 | — | — | |
| Propene SCHEMBL23236429 | 0.82 | — | — | |
| Propene SCHEMBL23236431 | 0.82 | — | — | |
| Propene SCHEMBL1095311 | 0.82 | — | — | |
| Butadiene SCHEMBL9480214 | 0.80 | ALDH1A1 (0.41) | — | |
| Butadiene SCHEMBL8101388 | 0.80 | TSHR (0.37) | — | |
| Butadiene SCHEMBL8101392 | 0.80 | TSHR (0.37) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109476127-A | thermoplastic elastomer laminate and organic electroluminescent device | 日本瑞翁株式会社 | 2019-03-15 | — | — | CN | disclosed |
| CN-108472849-A | Method for producing thermoplastic resin film and cyclic olefin resin film | 富士胶片株式会社 | 2018-08-31 | — | — | CN | disclosed |
| CN-104541189-B | Optical film and its manufacture method, polarizer and liquid crystal display device | 富士胶片株式会社 | 2018-03-23 | — | — | CN | disclosed |
| CN-107531028-A | Transparent film, polarizing plate, and image display device | 富士胶片株式会社 | 2018-01-02 | — | — | CN | disclosed |
| CN-105122427-B | The manufacture method of semiconductor device manufacture temporary adhesion layered product and semiconductor device | 富士胶片株式会社 | 2017-09-19 | — | — | CN | disclosed |
| CN-105103267-B | Laminate for temporary bonding for manufacturing semiconductor device, and method for manufacturing semiconductor device | 富士胶片株式会社 | 2017-09-19 | — | — | CN | disclosed |
| CN-107075187-A | Composition, the manufacture method of piece, piece, layered product and the layered product with element wafer | 富士胶片株式会社 | 2017-08-18 | — | — | CN | disclosed |
| US-9308525-B2 | Methods for providing bond activation catalysts and related catalysts, systems, and methods | CALIFORNIA INSTITUTE OF TECHNOLOGY (US) | 2016-04-12 | — | — | US | disclosed |
| EP-2964378-A1 | METHODS FOR PROVIDING BOND ACTIVATION CATALYSTS AND RELATED CATALYSTS, SYSTEMS, AND METHODS | California Institute of Technology (US) | 2016-01-13 | — | — | EP | disclosed |
| WO-2014134367-A1 | METHODS FOR PROVIDING BOND ACTIVATION CATALYSTS AND RELATED CATALYSTS, SYSTEMS, AND METHODS | CALIFORNIA INSTITUTE OF TECHNOLOGY (US) | 2014-09-04 | — | — | WO | disclosed |
| US-20140243545-A1 | Methods for providing bond activation catalysts and related catalysts, systems, and methods | CALIFORNIA INSTITUTE OF TECHNOLOGY (US) | 2014-08-28 | — | — | US | disclosed |