SCHEMBL16018744

SCHEMBL16018744

C=C(C)C(=O)OCC(=O)OC1C2CC3COC1C3C2

nearest known ligand 0.41

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.41
THRB P10828 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10064066 0.85 ALDH1A1 (0.38) ALDH1A1
SCHEMBL16858287 0.81 ALDH1A1 (0.33) ALDH1A1
SCHEMBL26996583 0.81 ALDH1A1 (0.40) ALDH1A1THRB
SCHEMBL25129600 0.81
SCHEMBL22788080 0.80 ALDH1A1 (0.35) ALDH1A1
SCHEMBL15426672 0.78 BCHE (0.35)
SCHEMBL13180423 0.78 ALDH1A1 (0.34) ALDH1A1
SCHEMBL22618185 0.77 ALDH1A1 (0.33) ALDH1A1
SCHEMBL22131520 0.77 ALDH1A1 (0.33) ALDH1A1
SCHEMBL19187317 0.77 ALDH1A1 (0.33) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11874603-B2 Photoresist composition comprising amide compound and pattern formation methods using the same ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) 2024-01-16 US disclosed
US-11874603-B2 Photoresist composition comprising amide compound and pattern formation methods using the same ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) 2024-01-16 US disclosed
US-20230099348-A1 PHOTORESIST COMPOSITION COMPRISING AMIDE COMPOUND AND PATTERN FORMATION METHODS USING THE SAME DUPONT SPECIALTY MATERIALS KOREA LTD (KR) 2023-03-30 US disclosed
US-9563124-B2 Photoresist composition and method for producing photoresist pattern SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2017-02-07 US disclosed
US-9017924-B2 Resist composition, method of forming resist pattern, polymeric compound and compound TOKYO OHKA KOGYO CO., LTD. (JP) 2015-04-28 US disclosed
US-20140255853-A1 RESIST COMPOSITION, METHOD OF FORMING RESIST PATTERN, POLYMERIC COMPOUND AND COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 2014-09-11 US disclosed