SCHEMBL160331

SCHEMBL160331

COC(=O)C(C)=C(C)CCC(CO)(CO)CO

nearest known ligand 0.32

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.32
TET2 Q6N021 1/20 0.31
KDM4E B2RXH2 1/20 0.31
PKM P14618 1/20 0.31
TSHR P16473 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1468169 0.81
SCHEMBL3653297 0.80 ALDH1A1 (0.34) ALDH1A1TET2TSHR
SCHEMBL28556163 0.80 ALDH1A1 (0.34) ALDH1A1TET2TSHR
SCHEMBL1322652 0.80 ALDH1A1 (0.34) ALDH1A1TET2
SCHEMBL15988024 0.79 ALDH1A1 (0.30) ALDH1A1
SCHEMBL27569466 0.78 ALDH1A1 (0.33) ALDH1A1TET2TSHR
SCHEMBL29232987 0.77 ALDH1A1 (0.39) ALDH1A1TET2TSHR
Ammonia Solution, Strong SCHEMBL28895262 0.75 ALDH1A1 (0.37) ALDH1A1TET2TSHR
SCHEMBL4070528 0.75 ALDH1A1 (0.37) ALDH1A1TET2KDM4EPKM
SCHEMBL15169830 0.75 ALDH1A1 (0.37) ALDH1A1TET2KDM4EPKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 405 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023204582-A1 GEL ELECTROLYTE AND ENERGY STORAGE DEVICE COMPRISING SAME 프로지니어 주식회사 2023-10-26 WO claimed
US-20220040914-A1 FUNCTIONALIZED PRODUCT FABRICATED FROM A RESIN COMPRISING A FUNCTIONAL COMPONENT AND A POLYMERIC RESIN, AND METHOD OF MAKING THE SAME NATIONAL RESEARCH COUNCIL OF CANADA (CA) 2022-02-10 US claimed
US-10947417-B2 Thermal-curable adhesive composition and adhesive sheet TAIMIDE TECH. INC. (TW) 2021-03-16 US claimed
WO-2020079669-A1 FUNCTIONALIZED PRODUCT FABRICATED FROM A RESIN COMPRISING A FUNCTIONAL COMPONENT AND A POLYMERIC RESIN, AND METHOD OF MAKING THE SAME NATIONAL RESEARCH COUNCIL OF CANADA (CA) 2020-04-23 WO claimed
CN-106432781-A Thermal expansion microcapsule, method for preparing same and application of thermal expansion microcapsule 三明市锦浪新材料科技有限公司 2017-02-22 CN claimed
US-8940172-B2 Super-macroporous polymeric microspheres and preparation method thereof INSTITUTE OF PROCESS ENGINEERING, CHINESE ACADEMY OF SCIENCES (CN) 2015-01-27 US claimed
EP-1756626-B1 POLYMERIZABLE COMPOSITIONS COMPRISING NANOPARTICLES 3M INNOVATIVE PROPERTIES CO (US) 2014-04-23 EP claimed
CN-102702449-B Preparation method of heat-resistant foamed microcapsule FUJIAN JINLANG FINE CHEMICAL CO LTD 2013-09-18 CN claimed
EP-2078061-B1 INKJET PRINTING XENNIA TECHNOLOGY LTD (GB) 2013-07-17 EP claimed
EP-2088160-B1 A SUPER MACROPOROUS POLYMERIC MICROSPHERE AND PREPARATION PROCESS THEREOF INST PROCESS ENG CAS (CN) 2012-10-31 EP claimed
EP-1820895-A2 Treated articles and methods of making and using same Rohm and Haas Company (US) 2007-08-22 EP claimed
WO-2007084297-A2 LIGHT-COLLIMATING FILM 3M INNOVATIVE PROPERTIES COMPANY (US) 2007-07-26 WO claimed
EP-1756626-A2 POLYMERIZABLE COMPOSITIONS COMPRISING NANOPARTICLES 3M Innovative Properties Company (US) 2007-02-28 EP claimed
EP-1742975-A1 POLYMERIZABLE COMPOSITIONS FOR OPTICAL ARTICLES 3M Innovative Properties Company (US) 2007-01-17 EP claimed
US-7153563-B2 Hard coat film LINTEC CORPORATION (JP) 2006-12-26 US claimed
WO-2006007286-A2 POLYMERIZABLE COMPOSITIONS COMPRISING NANOPARTICLES 3M INNOVATIVE PROPERTIES COMPANY (US) 2006-01-19 WO claimed
WO-2005066230-A1 POLYMERIZABLE COMPOSITIONS FOR OPTICAL ARTICLES 3M INNOVATIVE PROPERTIES COMPANY (US) 2005-07-21 WO claimed
US-20030220460-A1 THERMOSET COMPOSITION, METHOD, AND ARTICLE CITIBANK, N.A., AS COLLATERAL AGENT 2003-11-27 US claimed
US-5500286-A RESIN COMPOSITIONS FOR PAINTS, PAPER-COATING, AND HEAT-SENSITIVE RECORDING MATERIALS MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1996-03-19 US claimed
EP-0362735-A2 Unsaturated group-containing polycarboxylic acid resin, resin composition and solder resist resin composition comprising the same and cured product thereof NIPPON KAYAKU KABUSHIKI KAISHA (JP) 1990-04-11 EP claimed