Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CPN1 | P15169 | 1/20 | 0.45 |
| ▸ | CPB2 | Q96IY4 | 1/20 | 0.45 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.42 |
| ▸ | TSHR | P16473 | 1/20 | 0.42 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.42 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.42 |
| ▸ | CA1 | P00915 | 3/20 | 0.41 |
| ▸ | CA2 | P00918 | 3/20 | 0.41 |
| ▸ | CA9 | Q16790 | 2/20 | 0.41 |
| ▸ | AOC3 | Q16853 | 2/20 | 0.37 |
| ▸ | LMNA | P02545 | 1/20 | 0.37 |
| ▸ | CA12 | O43570 | 1/20 | 0.36 |
| ▸ | CA4 | P22748 | 1/20 | 0.36 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.36 |
| ▸ | SRC | P12931 | 1/20 | 0.35 |
| ▸ | CYP3A4 | P08684 | 4/20 | 0.35 |
| ▸ | CYP2D6 | P10635 | 3/20 | 0.35 |
| ▸ | SLC6A2 | P23975 | 3/20 | 0.35 |
| ▸ | SLC6A4 | P31645 | 3/20 | 0.35 |
| ▸ | SLC6A3 | Q01959 | 3/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1606351 | 0.91 | CPN1 (0.43) | CPN1CPB2ALDH1A1TSHRHSD17B10 | |
| SCHEMBL1607256 | 0.87 | CPN1 (0.47) | CPN1CPB2ALDH1A1TSHRHSD17B10 | |
| SCHEMBL2990881 | 0.86 | CA1 (0.42) | CPN1CPB2ALDH1A1TSHRHSD17B10 | |
| SCHEMBL1606418 | 0.81 | CPN1 (0.45) | CPN1CPB2ALDH1A1TSHRHSD17B10 | |
| SCHEMBL9063125 | 0.81 | CPN1 (0.47) | CPN1CPB2ALDH1A1TSHRHSD17B10 | |
| SCHEMBL3141262 | 0.80 | SRC (0.50) | ALDH1A1TDP1CA1CA2AOC3 | |
| SCHEMBL10614020 | 0.77 | CPN1 (0.44) | CPN1CPB2ALDH1A1TSHRHSD17B10 | |
| SCHEMBL9158459 | 0.76 | CPN1 (0.45) | CPN1CPB2ALDH1A1TSHRTDP1 | |
| SCHEMBL14465479 | 0.76 | CPN1 (0.41) | CPN1CPB2ALDH1A1TSHRHSD17B10 | |
| SCHEMBL15178195 | 0.76 | CPN1 (0.45) | CPN1CPB2ALDH1A1TSHRTDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8313892-B2 | Multi-layer body, method for forming resist pattern, method for manufacturing device having pattern by fine processing and electronic device | FUJITSU LIMITED (JP) | 2012-11-20 | — | — | US | claimed |
| EP-2138897-B1 | CONDUCTIVE ANTI-REFLECTION FILM, METHOD FOR FORMATION OF RESIST PATTERN | FUJITSU LTD (JP) | 2016-08-03 | — | — | EP | disclosed |
| US-8795951-B2 | Material for forming resist sensitization film and production method of semiconductor device | FUJITSU LIMITED (JP) | 2014-08-05 | — | — | US | disclosed |
| US-8557144-B2 | Material for forming conductive antireflection film, method for forming conductive antireflection film, method for forming resist pattern, semiconductor device, and magnetic head | FUJITSU LIMITED (JP) | 2013-10-15 | — | — | US | disclosed |
| US-8313892-B2 | Multi-layer body, method for forming resist pattern, method for manufacturing device having pattern by fine processing and electronic device | FUJITSU LIMITED (JP) | 2012-11-20 | — | — | US | disclosed |
| US-20110081615-A1 | MATERIAL FOR FORMING RESIST SENSITIZATION FILM AND PRODUCTION METHOD OF SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2011-04-07 | — | — | US | disclosed |
| US-20100009296-A1 | MATERIAL FOR FORMING CONDUCTIVE ANTIREFLECTION FILM, METHOD FOR FORMING CONDUCTIVE ANTIREFLECTION FILM, METHOD FOR FORMING RESIST PATTERN, SEMICONDUCTOR DEVICE, AND MAGNETIC HEAD | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2138897-A1 | MATERIAL FOR FORMATION OF CONDUCTIVE ANTI-REFLECTION FILM, METHOD FOR FORMATION OF CONDUCTIVE ANTI-REFLECTION FILM, METHOD FOR FORMATION OF RESIST PATTERN, SEMICONDUCTOR DEVICE, AND MAGNETIC HEAD | Fujitsu Limited (JP) | 2009-12-30 | — | — | EP | disclosed |
| EP-1612603-A2 | Multi-layer body, method for forming resist pattern, method for manufacturing device having pattern by fine processing and electronic device | FUJITSU LIMITED (JP) | 2006-01-04 | — | — | EP | disclosed |
| US-20050277055-A1 | Multi-layer body, method for forming resist pattern, method for manufacturing device having pattern by fine processing and electronic device | FUJITSU LIMITED (JP) | 2005-12-15 | — | — | US | disclosed |
| EP-0459255-B1 | Method for suppression of electrification | HITACHI LTD (JP) | 1998-03-18 | — | — | EP | disclosed |
| US-5589270-A | Processed substrate obtained by a process for effecting suppression of electrification | HITACHI, LTD. (JP) | 1996-12-31 | — | — | US | disclosed |
| US-5437893-A | Method for suppression of electrification | HITACHI, LTD (JP) | 1995-08-01 | — | — | US | disclosed |
| US-5256454-A | Method for suppression of electrification | HITACHI, LTD. (JP) | 1993-10-26 | — | — | US | disclosed |
| EP-0459255-A2 | Method for suppression of electrification | HITACHI, LTD. (JP) | 1991-12-04 | — | — | EP | disclosed |