SCHEMBL1607256

SCHEMBL1607256

CCC(c1cccc(N)c1)S(=O)(=O)O

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CPN1 P15169 1/20 0.47
CPB2 Q96IY4 1/20 0.47
ALDH1A1 P00352 2/20 0.44
TSHR P16473 1/20 0.44
HSD17B10 Q99714 1/20 0.44
TDP1 Q9NUW8 1/20 0.44
CA1 P00915 2/20 0.43
CA2 P00918 2/20 0.43
CA9 Q16790 2/20 0.43
LMNA P02545 2/20 0.39
HDAC4 P56524 1/20 0.38
HDAC2 Q92769 1/20 0.38
HDAC8 Q9BY41 1/20 0.38
CA12 O43570 1/20 0.38
CA4 P22748 1/20 0.38
CA14 Q9ULX7 1/20 0.38
SRC P12931 1/20 0.37
CYP3A4 P08684 4/20 0.36
CYP2D6 P10635 3/20 0.36
SLC6A2 P23975 3/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1607460 0.87 CPN1 (0.45) CPN1CPB2ALDH1A1TSHRHSD17B10
SCHEMBL1606351 0.84 CPN1 (0.43) CPN1CPB2ALDH1A1TSHRHSD17B10
SCHEMBL1606418 0.84 CPN1 (0.45) CPN1CPB2ALDH1A1TSHRHSD17B10
SCHEMBL9063125 0.83 CPN1 (0.47) CPN1CPB2ALDH1A1TSHRHSD17B10
SCHEMBL10614020 0.80 CPN1 (0.44) CPN1CPB2ALDH1A1TSHRHSD17B10
SCHEMBL3398553 0.78 SRC (0.53) ALDH1A1TDP1LMNASRCCYP2D6
SCHEMBL3398560 0.78 SRC (0.53) ALDH1A1TDP1LMNASRCCYP2D6
SCHEMBL249115 0.78 SRC (0.53) ALDH1A1TDP1LMNASRCCYP2D6
SCHEMBL8860031 0.77 ALDH1A1 (0.48) CPN1CPB2ALDH1A1TSHRHSD17B10
SCHEMBL1607253 0.77 ALDH1A1 (0.48) CPN1CPB2ALDH1A1TSHRHSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8313892-B2 Multi-layer body, method for forming resist pattern, method for manufacturing device having pattern by fine processing and electronic device FUJITSU LIMITED (JP) 2012-11-20 US claimed
EP-2138897-B1 CONDUCTIVE ANTI-REFLECTION FILM, METHOD FOR FORMATION OF RESIST PATTERN FUJITSU LTD (JP) 2016-08-03 EP disclosed
US-8795951-B2 Material for forming resist sensitization film and production method of semiconductor device FUJITSU LIMITED (JP) 2014-08-05 US disclosed
US-8557144-B2 Material for forming conductive antireflection film, method for forming conductive antireflection film, method for forming resist pattern, semiconductor device, and magnetic head FUJITSU LIMITED (JP) 2013-10-15 US disclosed
US-8313892-B2 Multi-layer body, method for forming resist pattern, method for manufacturing device having pattern by fine processing and electronic device FUJITSU LIMITED (JP) 2012-11-20 US disclosed
US-20110081615-A1 MATERIAL FOR FORMING RESIST SENSITIZATION FILM AND PRODUCTION METHOD OF SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-04-07 US disclosed
US-20100009296-A1 MATERIAL FOR FORMING CONDUCTIVE ANTIREFLECTION FILM, METHOD FOR FORMING CONDUCTIVE ANTIREFLECTION FILM, METHOD FOR FORMING RESIST PATTERN, SEMICONDUCTOR DEVICE, AND MAGNETIC HEAD FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2138897-A1 MATERIAL FOR FORMATION OF CONDUCTIVE ANTI-REFLECTION FILM, METHOD FOR FORMATION OF CONDUCTIVE ANTI-REFLECTION FILM, METHOD FOR FORMATION OF RESIST PATTERN, SEMICONDUCTOR DEVICE, AND MAGNETIC HEAD Fujitsu Limited (JP) 2009-12-30 EP disclosed
EP-1612603-A2 Multi-layer body, method for forming resist pattern, method for manufacturing device having pattern by fine processing and electronic device FUJITSU LIMITED (JP) 2006-01-04 EP disclosed
US-20050277055-A1 Multi-layer body, method for forming resist pattern, method for manufacturing device having pattern by fine processing and electronic device FUJITSU LIMITED (JP) 2005-12-15 US disclosed
EP-0459255-B1 Method for suppression of electrification HITACHI LTD (JP) 1998-03-18 EP disclosed
US-5589270-A Processed substrate obtained by a process for effecting suppression of electrification HITACHI, LTD. (JP) 1996-12-31 US disclosed
US-5437893-A Method for suppression of electrification HITACHI, LTD (JP) 1995-08-01 US disclosed
US-5256454-A Method for suppression of electrification HITACHI, LTD. (JP) 1993-10-26 US disclosed
EP-0459255-A2 Method for suppression of electrification HITACHI, LTD. (JP) 1991-12-04 EP disclosed