SCHEMBL1607516

SCHEMBL1607516

O=S(=O)(O)CCCCCNc1ccccc1

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.57
MAPT P10636 2/20 0.57
HDAC1 Q13547 3/20 0.47
HDAC3 O15379 1/20 0.47
HDAC2 Q92769 1/20 0.47
NCOR2 Q9Y618 1/20 0.47
CA12 O43570 1/20 0.43
CA2 P00918 1/20 0.43
CA9 Q16790 1/20 0.43
KDM4E B2RXH2 1/20 0.43
LMNA P02545 1/20 0.43
PKM P14618 1/20 0.43
SMN1; SMN2 Q16637 1/20 0.43
HDAC6 Q9UBN7 1/20 0.42
KCNH3 Q9ULD8 1/20 0.41
L3MBTL1 Q9Y468 1/20 0.41
PRSS1 P07477 4/20 0.41
F2 P00734 2/20 0.41
PRSS2 P07478 2/20 0.41
PRSS3 P35030 2/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8969772 1.00 ALDH1A1 (0.57) ALDH1A1MAPTHDAC1HDAC3HDAC2
SCHEMBL1606652 1.00 ALDH1A1 (0.57) ALDH1A1MAPTHDAC1HDAC3HDAC2
SCHEMBL1607454 1.00 ALDH1A1 (0.57) ALDH1A1MAPTHDAC1HDAC3HDAC2
SCHEMBL8969890 0.98 ALDH1A1 (0.55) ALDH1A1MAPTHDAC1HDAC3HDAC2
SCHEMBL8968746 0.98 ALDH1A1 (0.55) ALDH1A1MAPTHDAC1HDAC3HDAC2
SCHEMBL8968708 0.98 ALDH1A1 (0.55) ALDH1A1MAPTHDAC1HDAC3HDAC2
SCHEMBL1607864 0.98 ALDH1A1 (0.59) ALDH1A1MAPTHDAC1HDAC3HDAC2
SCHEMBL8969604 0.96 ALDH1A1 (0.57) ALDH1A1MAPTHDAC1HDAC3HDAC2
SCHEMBL246721 0.94 ALDH1A1 (0.59) ALDH1A1MAPTHDAC1HDAC3HDAC2
SCHEMBL1333377 0.93 ALDH1A1 (0.57) ALDH1A1MAPTHDAC1HDAC3HDAC2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8313892-B2 Multi-layer body, method for forming resist pattern, method for manufacturing device having pattern by fine processing and electronic device FUJITSU LIMITED (JP) 2012-11-20 US claimed
EP-2138897-B1 CONDUCTIVE ANTI-REFLECTION FILM, METHOD FOR FORMATION OF RESIST PATTERN FUJITSU LTD (JP) 2016-08-03 EP disclosed
US-8795951-B2 Material for forming resist sensitization film and production method of semiconductor device FUJITSU LIMITED (JP) 2014-08-05 US disclosed
US-8557144-B2 Material for forming conductive antireflection film, method for forming conductive antireflection film, method for forming resist pattern, semiconductor device, and magnetic head FUJITSU LIMITED (JP) 2013-10-15 US disclosed
US-8313892-B2 Multi-layer body, method for forming resist pattern, method for manufacturing device having pattern by fine processing and electronic device FUJITSU LIMITED (JP) 2012-11-20 US disclosed
US-20110081615-A1 MATERIAL FOR FORMING RESIST SENSITIZATION FILM AND PRODUCTION METHOD OF SEMICONDUCTOR DEVICE FUJITSU LIMITED (JP) 2011-04-07 US disclosed
US-20100009296-A1 MATERIAL FOR FORMING CONDUCTIVE ANTIREFLECTION FILM, METHOD FOR FORMING CONDUCTIVE ANTIREFLECTION FILM, METHOD FOR FORMING RESIST PATTERN, SEMICONDUCTOR DEVICE, AND MAGNETIC HEAD FUJITSU LIMITED (JP) 2010-01-14 US disclosed
EP-2138897-A1 MATERIAL FOR FORMATION OF CONDUCTIVE ANTI-REFLECTION FILM, METHOD FOR FORMATION OF CONDUCTIVE ANTI-REFLECTION FILM, METHOD FOR FORMATION OF RESIST PATTERN, SEMICONDUCTOR DEVICE, AND MAGNETIC HEAD Fujitsu Limited (JP) 2009-12-30 EP disclosed
EP-1612603-A2 Multi-layer body, method for forming resist pattern, method for manufacturing device having pattern by fine processing and electronic device FUJITSU LIMITED (JP) 2006-01-04 EP disclosed
US-20050277055-A1 Multi-layer body, method for forming resist pattern, method for manufacturing device having pattern by fine processing and electronic device FUJITSU LIMITED (JP) 2005-12-15 US disclosed
EP-0459255-B1 Method for suppression of electrification HITACHI LTD (JP) 1998-03-18 EP disclosed
US-5589270-A Processed substrate obtained by a process for effecting suppression of electrification HITACHI, LTD. (JP) 1996-12-31 US disclosed
US-5437893-A Method for suppression of electrification HITACHI, LTD (JP) 1995-08-01 US disclosed
US-5380456-A Aromatic aminosulfonic acid, liquid bleach UNITED STATES BORAX & CHEMICAL CORPORATION (US) 1995-01-10 US disclosed
US-5256454-A Method for suppression of electrification HITACHI, LTD. (JP) 1993-10-26 US disclosed
EP-0466902-A4 STABILIZATION OF AQUEOUS PEROXYGEN SOLUTIONS 1992-05-20 EP disclosed
EP-0466902-A1 STABILIZATION OF AQUEOUS SOLUTIONS CONTAINING SODIUM PERBORATE OR SODIUM PERCARBONATE UNITED STATES BORAX & CHEMICAL CORPORATION (US) 1992-01-22 EP disclosed
EP-0459255-A2 Method for suppression of electrification HITACHI, LTD. (JP) 1991-12-04 EP disclosed
WO-1991011388-A1 STABILIZATION OF AQUEOUS PEROXYGEN SOLUTIONS UNITED STATES BORAX & CHEMICAL CORPORATION (US) 1991-08-08 WO disclosed