SCHEMBL1607985

SCHEMBL1607985

CCCCC(OC)O[SiH2]C

nearest known ligand 0.32

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
CA1 P00915 1/20 0.32
CA2 P00918 1/20 0.32
DNM1 Q05193 2/20 0.32
SMPD1 P17405 3/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28187787 0.80 CA1 (0.31) CA1CA2DNM1SMPD1
SCHEMBL611894 0.80
SCHEMBL28448616 0.78 CA1 (0.31) CA1CA2DNM1
SCHEMBL16497119 0.78 CA1 (0.31) CA1CA2DNM1
SCHEMBL5708974 0.75 DNM1 (0.38) CA1CA2DNM1SMPD1
SCHEMBL1608796 0.75
SCHEMBL16497407 0.75
SCHEMBL16497587 0.73
SCHEMBL167839 0.72 SMPD1 (0.46) DNM1SMPD1
SCHEMBL3329185 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 84 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4197330-A1 BIOCONTROL OF FUNGAL PHYTOPATHOGENS BY BACTERIAL VOLATILE ORGANIC COMPOUNDS King Abdullah University of Science and Technology (SA) 2023-06-21 EP claimed
CN-116075368-B Resin composition, cured product, method for producing same, and laminate 三菱化学株式会社 2024-06-11 CN disclosed
US-11912889-B2 Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer TOKYO OHKA KOGYO CO., LTD. (JP) 2024-02-27 US disclosed
US-20230257503-A1 RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE MITSUBISHI CHEMICAL CORPORATION (JP) 2023-08-17 US disclosed
EP-4212256-A1 RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE Mitsubishi Chemical Corporation (JP) 2023-07-19 EP disclosed
US-11649421-B2 Apparatus and method for preserving the aroma of a fermentable beverage AROMALOC INC. (CA) 2023-05-16 US disclosed
CN-116075368-A Resin composition, cured product, method for producing same, and laminate 三菱化学株式会社 2023-05-05 CN disclosed
US-11542397-B2 Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device TOKYO OHKA KOGYO CO., LTD. (JP) 2023-01-03 US disclosed
US-11466237-B2 Apparatus and method for preserving the aroma of a fermentable beverage AROMALOC INC. (CA) 2022-10-11 US disclosed
US-11413682-B2 Method for producing surface-modified metal oxide fine particle, method for producing improved metal oxide fine particles, surface-modified metal oxide fine particles, and metal oxide fine particle dispersion liquid TOKYO OHKA KOGYO CO., LTD. (JP) 2022-08-16 US disclosed
US-8475690-B2 Diffusing agent composition, method of forming impurity diffusion layer, and solar battery TOKYO OHKA KOGYO CO., LTD. (JP) 2013-07-02 US disclosed
US-20130109123-A1 DIFFUSING AGENT COMPOSITION AND METHOD OF FORMING IMPURITY DIFFUSION LAYER TOKYO OHKA KOGYO CO., LTD. (JP) 2013-05-02 US disclosed
EP-2573800-A1 DIFFUSION AGENT COMPOSITION, METHOD OF FORMING AN IMPURITY DIFFUSION LAYER, AND SOLAR CELL Tokyo Ohka Kogyo Co., Ltd. (JP) 2013-03-27 EP disclosed
US-20130061922-A1 DIFFUSION AGENT COMPOSITION, METHOD OF FORMING IMPURITY DIFFUSION LAYER, AND SOLAR CELL TOKYO OHKA KOGYO CO., LTD. (JP) 2013-03-14 US disclosed
EP-2472655-A1 Negative electrode base member Tokyo Ohka Kogyo Co., Ltd. (JP) 2012-07-04 EP disclosed
US-20110079262-A1 DIFFUSING AGENT COMPOSITION, METHOD OF FORMING IMPURITY DIFFUSION LAYER, AND SOLAR BATTERY TOKYO OHKA KOGYO CO., LTD. (JP) 2011-04-07 US disclosed
US-20110017291-A1 DIFFUSING AGENT COMPOSITION FOR INK-JET, AND METHOD FOR PRODUCTION OF ELECTRODE OR SOLAR BATTERY USING THE COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2011-01-27 US disclosed
US-20100119939-A1 NEGATIVE ELECTRODE BASE MEMBER TOKYO OHKA KOGYO CO., LTD. (JP) 2010-05-13 US disclosed
EP-2131423-A1 NEGATIVE ELECTRODE BASE MEMBER Tokyo Ohka Kogyo Co., Ltd. (JP) 2009-12-09 EP disclosed
US-20080318165-A1 Composition For Forming Antireflective Film And Wiring Forming Method Using Same TOKYO OHKA KOGYO CO., LTD. (JP) 2008-12-25 US disclosed