SCHEMBL1608307

SCHEMBL1608307

C1=COc2ccccc2C1.[Mo].[Ni].[V]

nearest known ligand 0.37

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
MAOA P21397 1/20 0.37
MAOB P27338 1/20 0.37
OXTR P30559 1/20 0.35
LMNA P02545 2/20 0.32
CRHBP P24387 2/20 0.32
CRHR2 Q13324 2/20 0.32
SMN1; SMN2 Q16637 2/20 0.32
HTT P42858 1/20 0.32
ABCG2 Q9UNQ0 1/20 0.31
ITGB2 P05107 1/20 0.31
ICAM1 P05362 1/20 0.31
ITGAL P20701 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8996289 0.98 MAOA (0.38) MAOAMAOBOXTRLMNACRHBP
SCHEMBL1943716 0.98 MAOA (0.38) MAOAMAOBOXTRLMNACRHBP
SCHEMBL30217 0.98 MAOA (0.38) MAOAMAOBOXTRLMNACRHBP
Methane SCHEMBL8521236 0.96 MAOA (0.37) MAOAMAOBOXTRLMNACRHBP
SCHEMBL4442977 0.96 MAOA (0.37) MAOAMAOBOXTRLMNACRHBP
SCHEMBL6012019 0.96 MAOA (0.37) MAOAMAOBOXTRLMNACRHBP
SCHEMBL433217 0.96 MAOA (0.37) MAOAMAOBOXTRLMNACRHBP
SCHEMBL3406846 0.96 MAOA (0.37) MAOAMAOBOXTRLMNACRHBP
SCHEMBL491099 0.96 MAOA (0.39) MAOAMAOBOXTRLMNACRHBP
SCHEMBL39996 0.96 MAOA (0.39) MAOAMAOBOXTRLMNACRHBP

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8288011-B2 Adhesiveless copper clad laminates and method for manufacturing thereof SUMITOMO METAL MINING CO., LTD. (JP) 2012-10-16 US claimed
US-20110081557-A1 Adhesiveless copper clad laminates and method for manufacturing thereof NAGATA JUNICHI 2011-04-07 US claimed
US-20080102305-A1 Adhesiveless Copper Clad Laminates And Method For Manufacturing Thereof SUMITOMO METAL MINING CO., LTD. 2008-05-01 US claimed
US-8288011-B2 Adhesiveless copper clad laminates and method for manufacturing thereof SUMITOMO METAL MINING CO., LTD. (JP) 2012-10-16 US disclosed
US-20110081557-A1 Adhesiveless copper clad laminates and method for manufacturing thereof NAGATA JUNICHI 2011-04-07 US disclosed
US-20080102305-A1 Adhesiveless Copper Clad Laminates And Method For Manufacturing Thereof SUMITOMO METAL MINING CO., LTD. 2008-05-01 US disclosed