Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TAS1R3 | Q7RTX0 | 1/20 | 0.41 |
| ▸ | TAS1R1 | Q7RTX1 | 1/20 | 0.41 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.37 |
| ▸ | PPARG | P37231 | 3/20 | 0.35 |
| ▸ | PPARA | Q07869 | 3/20 | 0.35 |
| ▸ | EP300 | Q09472 | 1/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
| ▸ | HCAR2 | Q8TDS4 | 1/20 | 0.33 |
| ▸ | GRIK1 | P39086 | 1/20 | 0.32 |
| ▸ | GRIK2 | Q13002 | 1/20 | 0.32 |
| ▸ | ACHE | P22303 | 1/20 | 0.32 |
| ▸ | BACE1 | P56817 | 1/20 | 0.32 |
| ▸ | GMNN | O75496 | 1/20 | 0.32 |
| ▸ | USP2 | O75604 | 1/20 | 0.32 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.32 |
| ▸ | POLB | P06746 | 1/20 | 0.32 |
| ▸ | MAPT | P10636 | 1/20 | 0.32 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.32 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1608392 | 1.00 | TAS1R3 (0.41) | TAS1R3TAS1R1PTPN1PPARGPPARA | |
| SCHEMBL1682386 | 0.87 | F7 (0.47) | PTPN1PPARGPPARAGMNNUSP2 | |
| SCHEMBL1682383 | 0.87 | F7 (0.47) | PTPN1PPARGPPARAGMNNUSP2 | |
| SCHEMBL10295983 | 0.84 | PPARG (0.54) | PTPN1PPARGPPARAGMNNUSP2 | |
| SCHEMBL11161474 | 0.84 | PPARG (0.54) | PTPN1PPARGPPARAGMNNUSP2 | |
| SCHEMBL6655809 | 0.84 | PPARG (0.54) | PTPN1PPARGPPARAGMNNUSP2 | |
| SCHEMBL11550561 | 0.84 | PPARG (0.54) | PTPN1PPARGPPARAGMNNUSP2 | |
| SCHEMBL11546604 | 0.84 | PPARG (0.54) | PTPN1PPARGPPARAGMNNUSP2 | |
| SCHEMBL9021396 | 0.84 | PPARG (0.54) | PTPN1PPARGPPARAGMNNUSP2 | |
| SCHEMBL8469325 | 0.84 | PPARG (0.54) | PTPN1PPARGPPARAGMNNUSP2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113906065-B | Copolymer for polymer electrolyte, gel polymer electrolyte including the same, and lithium secondary battery | 株式会社LG新能源 | 2024-05-28 | — | — | CN | disclosed |
| CN-114957258-A | Synthesis of wide-spectrum serine beta-lactamase inhibitor based on carbapenem structure and application of inhibitor in drug-resistant bacteria inhibition | 华东理工大学 | 2022-08-30 | — | — | CN | disclosed |
| WO-2021253302-A1 | CONDUCTIVE COMPOSITION FOR SECONDARY BATTERY | GUANGDONG HAOZHI TECHNOLOGY CO. LIMITED (CN) | 2021-12-23 | — | — | WO | disclosed |
| US-8673539-B2 | Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-03-18 | — | — | US | disclosed |
| US-8445177-B2 | Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-05-21 | — | — | US | disclosed |
| US-20130062787-A1 | PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART | RESONAC CORPORATION (JP) | 2013-03-14 | — | — | US | disclosed |
| US-8323873-B2 | Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-12-04 | — | — | US | disclosed |
| US-8293453-B2 | Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-10-23 | — | — | US | disclosed |
| US-8278024-B2 | Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-10-02 | — | — | US | disclosed |
| EP-2333609-A2 | Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part | Hitachi Chemical Company, Ltd. (JP) | 2011-06-15 | — | — | EP | disclosed |
| US-20110079927-A1 | PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART | RESONAC CORPORATION (JP) | 2011-04-07 | — | — | US | disclosed |
| US-20110065043-A1 | PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART | RESONAC CORPORATION (JP) | 2011-03-17 | — | — | US | disclosed |
| US-20110065260-A1 | PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART | KAWAMORI TAKASHI | 2011-03-17 | — | — | US | disclosed |
| US-20100314783-A1 | PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART | KAWAMORI TAKASHI | 2010-12-16 | — | — | US | disclosed |
| US-7851131-B2 | Photopolymerization; polyimides; photomasks; wafers; sheets; films | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2010-12-14 | — | — | US | disclosed |
| US-20080176167-A1 | Photopolymerization; polyimides; photomasks; wafers; sheets; films | RESONAC CORPORATION (JP) | 2008-07-24 | — | — | US | disclosed |
| EP-1901123-A1 | PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2008-03-19 | — | — | EP | disclosed |
| US-5633112-A | Photosensitive resin composition containing a carboxylic acid polymer, photoacid generator and secondary or tertiary aliphatic amine | HITACHI, LTD. (JP) | 1997-05-27 | — | — | US | disclosed |
| EP-0177791-A2 | Radiation curable primer coating compositions | SUMITOMO METAL INDUSTRIES, LTD. (JP) | 1986-04-16 | — | — | EP | disclosed |