⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19816493 | 0.93 | TSHR (0.32) | — | |
| SCHEMBL19927468 | 0.91 | TSHR (0.36) | — | |
| SCHEMBL272794 | 0.87 | TSHR (0.33) | — | |
| SCHEMBL1609077 | 0.84 | — | — | |
| Ammonia Solution, Strong SCHEMBL15206186 | 0.84 | TSHR (0.32) | — | |
| Water SCHEMBL28187599 | 0.84 | TSHR (0.32) | — | |
| SCHEMBL274371 | 0.84 | — | — | |
| SCHEMBL16496854 | 0.83 | — | — | |
| SCHEMBL16497582 | 0.83 | ADRB2 (0.35) | — | |
| SCHEMBL8022261 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 165 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1639023-A4 | POLYMERIZATION CATALYST SYSTEM USING DI-SEC-BUTYLDIMETHOXYSILANE FOR PREPARATION OF POLYPROPYLENE | FINA TECHNOLOGY (US) | 2007-07-25 | — | — | EP | claimed |
| EP-1639023-A2 | POLYMERIZATION CATALYST SYSTEM USING DI-SEC-BUTYLDIMETHOXYSILANE FOR PREPARATION OF POLYPROPYLENE | FINA TECHNOLOGY, INC. (US) | 2006-03-29 | — | — | EP | claimed |
| WO-2005003181-A2 | POLYMERIZATION CATALYST SYSTEM USING DI-SEC-BUTYLDIMETHOXYSILANE FOR PREPARATION OF POLYPROPYLENE | FINA TECHNOLOGY, INC. (US) | 2005-01-13 | — | — | WO | claimed |
| EP-3507104-B1 | PRODUCTION OF CIS-1,4-POLYDIENES WITH MULTIPLE SILANE FUNCTIONAL GROUPS PREPARED BYIN-SITU | BRIDGESTONE CORP (JP) | 2024-03-27 | — | — | EP | disclosed |
| US-11912889-B2 | Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-02-27 | — | — | US | disclosed |
| US-20230257503-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | MITSUBISHI CHEMICAL CORPORATION (JP) | 2023-08-17 | — | — | US | disclosed |
| EP-4212256-A1 | RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE | Mitsubishi Chemical Corporation (JP) | 2023-07-19 | — | — | EP | disclosed |
| US-11542397-B2 | Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-01-03 | — | — | US | disclosed |
| US-11413682-B2 | Method for producing surface-modified metal oxide fine particle, method for producing improved metal oxide fine particles, surface-modified metal oxide fine particles, and metal oxide fine particle dispersion liquid | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-08-16 | — | — | US | disclosed |
| CN-110249004-B | Polyimide precursor composition | 东京应化工业株式会社 | 2022-07-19 | — | — | CN | disclosed |
| US-20220220338-A1 | SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER | TOKYO OHKA KOGYO CO., LTD. (JP) | 2022-07-14 | — | — | US | disclosed |
| EP-1566836-A1 | SEMICONDUCTOR MULTILAYER INTERCONNECTION FORMING METHOD | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-08-24 | — | — | EP | disclosed |
| US-20050112383-A1 | Undercoating layer material for lithography and wiring forming method using the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-05-26 | — | — | US | disclosed |
| US-20050074695-A1 | Undercoating material for wiring, embedded material, and wiring formation method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-04-07 | — | — | US | disclosed |
| WO-2004113486-A1 | CLEANING COMPOSITION, METHOD OF CLEANING SEMICONDUCTOR SUBSTRATE, AND METHOD OF FORMING WIRING ON SEMICONDUCTOR SUBSTRATE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2004-12-29 | — | — | WO | disclosed |
| US-20040259761-A1 | Cleaning composition, method of cleaning semiconductor substrate, and method of forming wiring on semiconductor substrate | TOKYO OHKA KOGYO CO., LTD. INTEL CORPORATION | 2004-12-23 | — | — | US | disclosed |
| US-20040121937-A1 | Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith | TOKYO OHKA KOGYO CO., LTD. (JP) | 2004-06-24 | — | — | US | disclosed |
| CN-1495535-A | Etching solution for forming bimetallic mosaic structure craft and base phate treatment method | ͬ�Ϳ�ҵ��ʽ���� | 2004-05-12 | — | — | CN | disclosed |
| US-6515073-B2 | Comprising di-, tri- and/or tetra-(alkoxy/phenoxy)silanes and a thermosetting resin which can be condensed therewith which has an absorption capacity with respect to exposing light; can be etched at high rate for fine resist patterns | TOKYO OHKA KOGYO CO., LTD. (JP) | 2003-02-04 | — | — | US | disclosed |
| US-20010036998-A1 | Anti-reflective coating-forming composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2001-11-01 | — | — | US | disclosed |