Methyl Phosphonate

Methyl Phosphonate

SCHEMBL16143409

CCCC.CP(=O)(O)O

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10287420-B2 Thermal expansion resin composition SEKISUI CHEMICAL CO., LTD. (JP) 2019-05-14 US disclosed
EP-2787035-B1 THERMALLY EXPANDABLE MULTILAYER PACKING FOR BUILDING MATERIAL SEKISUI CHEMICAL CO LTD (JP) 2019-01-02 EP disclosed
US-9994693-B2 Thermally expandable resin composition SEKISUI CHEMICAL CO., LTD. (JP) 2018-06-12 US disclosed
EP-2907847-B1 THERMAL EXPANSION RESIN COMPOSITION SEKISUI CHEMICAL CO LTD (JP) 2017-10-04 EP disclosed
CN-104755555-B Thermally expandable resin composition 积水化学工业株式会社 2017-05-10 CN disclosed
CN-106046051-A Synthesis method of glufosinate intermediate of methyl diethyl phosphite 安徽国星生物化学有限公司 2016-10-26 CN disclosed
US-20150291773-A1 THERMAL EXPANSION RESIN COMPOSITION SEKISUI CHEMICAL CO., LTD. (JP) 2015-10-15 US disclosed
US-20150284525-A1 THERMALLY EXPANDABLE RESIN COMPOSITION SEKISUI CHEMICAL CO., LTD. (JP) 2015-10-08 US disclosed
EP-2907847-A1 THERMAL EXPANSION RESIN COMPOSITION Sekisui Chemical Co., Ltd. (JP) 2015-08-19 EP disclosed
EP-2907846-A1 THERMAL EXPANSION RESIN COMPOSITION Sekisui Chemical Co., Ltd. (JP) 2015-08-19 EP disclosed
CN-104755555-A Thermally expandable resin composition SEKISUI CHEMICAL CO LTD 2015-07-01 CN disclosed
CN-104718252-A Thermally expandable resin composition SEKISUI CHEMICAL CO LTD 2015-06-17 CN disclosed
US-20140345886-A1 THERMALLY EXPANDABLE MULTILAYER PACKING FOR BUILDING MATERIAL SEKISUI CHEMICAL CO., LTD. (JP) 2014-11-27 US disclosed
EP-2787035-A1 THERMALLY EXPANDABLE MULTILAYER PACKING FOR BUILDING MATERIAL Sekisui Chemical Co., Ltd. (JP) 2014-10-08 EP disclosed
CN-101094677-A Protein tyrosine phosphatase inhibitors and methods of use thereof CEPTYR INC (US) 2007-12-26 CN disclosed