SCHEMBL16223403

SCHEMBL16223403

C=C(C)C(=O)OCCCCCCCCC[Si](C)(OCC)OCC

nearest known ligand 0.60

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
TSHR P16473 4/20 0.60
THRB P10828 1/20 0.49
POLB P06746 1/20 0.43
APEX1 P27695 1/20 0.43
HTT P42858 1/20 0.43
TDP1 Q9NUW8 1/20 0.43
ALDH1A1 P00352 4/20 0.36
ACHE P22303 7/20 0.33
NAAA Q02083 1/20 0.33
RAD52 P43351 1/20 0.32
NPSR1 Q6W5P4 1/20 0.32
EPHX1 P07099 1/20 0.31
CYP3A4 P08684 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16223294 1.00 TSHR (0.60) TSHRTHRBPOLBAPEX1HTT
SCHEMBL16223551 1.00 TSHR (0.60) TSHRTHRBPOLBAPEX1HTT
SCHEMBL16537545 1.00 TSHR (0.60) TSHRTHRBPOLBAPEX1HTT
SCHEMBL16223360 1.00 TSHR (0.60) TSHRTHRBPOLBAPEX1HTT
SCHEMBL16223450 1.00 TSHR (0.60) TSHRTHRBPOLBAPEX1HTT
SCHEMBL16223414 1.00 TSHR (0.60) TSHRTHRBPOLBAPEX1HTT
SCHEMBL16223407 1.00 TSHR (0.60) TSHRTHRBPOLBAPEX1HTT
SCHEMBL16223433 1.00 TSHR (0.60) TSHRTHRBPOLBAPEX1HTT
SCHEMBL16223299 1.00 TSHR (0.60) TSHRTHRBPOLBAPEX1HTT
SCHEMBL486167 0.98 TSHR (0.57) TSHRTHRBPOLBAPEX1HTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240174780-A1 HOLLOW PARTICLES AND USE THEREOF SEKISUI KASEI CO., LTD. (JP) 2024-05-30 US disclosed
US-11883790-B2 Hollow particles, method for producing same, and usage of same SEKISUI KASEI CO., LTD. (JP) 2024-01-30 US disclosed
US-11369935-B2 Hollow particles and use thereof SEKISUI PLASTICS CO., LTD. (JP) 2022-06-28 US disclosed
EP-3766571-A1 HOLLOW PARTICLES, METHOD FOR PRODUCING SAME, AND USAGE OF SAME SEKISUI KASEI CO., LTD. (JP) 2021-01-20 EP disclosed
US-20210001300-A1 HOLLOW PARTICLES, METHOD FOR PRODUCING SAME, AND USAGE OF SAME SEKISUI KASEI CO., LTD. (JP) 2021-01-07 US disclosed
EP-3514192-A1 HOLLOW PARTICLES AND USE THEREOF Sekisui Plastics Co., Ltd. (JP) 2019-07-24 EP disclosed
US-20190209994-A1 HOLLOW PARTICLES AND USE THEREOF SEKISUI PLASTICS CO., LTD. (JP) 2019-07-11 US disclosed
US-9303180-B2 Low-temperature cureable coating composition and article having cured coating thereof SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-04-05 US disclosed
EP-2801596-B1 LOW-TEMPERATURE CURABLE COATING COMPOSITION AND ARTICLE HAVING CURED COATING THEREOF SHINETSU CHEMICAL CO (JP) 2016-03-23 EP disclosed
US-20140336329-A1 LOW-TEMPERATURE CUREABLE COATING COMPOSITION AND ARTICLE HAVING CURED COATING THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-11-13 US disclosed
EP-2801596-A1 Low-temperature curable coating composition and article having cured coating thereof Shin-Etsu Chemical Co., Ltd. (JP) 2014-11-12 EP disclosed