Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NISCH | Q9Y2I1 | 15/20 | 1.00 |
| ▸ | ADRA2A | P08913 | 1/20 | 0.50 |
| ▸ | ADRA2B | P18089 | 1/20 | 0.50 |
| ▸ | ADRA2C | P18825 | 1/20 | 0.50 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL11739268 | 0.92 | NISCH (0.84) | NISCH | |
| SCHEMBL4822597 | 0.89 | NISCH (0.80) | NISCH | |
| SCHEMBL9579892 | 0.86 | NISCH (0.81) | NISCH | |
| SCHEMBL4383292 | 0.82 | NISCH (0.70) | NISCH | |
| SCHEMBL24495595 | 0.82 | NISCH (0.69) | NISCH | |
| SCHEMBL8194068 | 0.80 | NISCH (0.77) | NISCHADRA2AADRA2BADRA2C | |
| SCHEMBL8205646 | 0.79 | NISCH (0.67) | NISCH | |
| SCHEMBL4821629 | 0.79 | NISCH (0.64) | NISCH | |
| SCHEMBL11516541 | 0.78 | NISCH (0.66) | NISCH | |
| SCHEMBL3394014 | 0.78 | NISCH (0.65) | NISCH |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 181 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1939935-B1 | Indium Compositions | ROHM & HAAS ELECT MAT (US) | 2018-12-05 | — | — | EP | claimed |
| US-8585885-B2 | Electrochemically deposited indium composites | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2013-11-19 | — | — | US | claimed |
| US-4246394-A | PROMOTER FOR CROSSLINKING | VEBA-CHEMIE AKTIENGESELLSCHAFT (DE) | 1981-01-20 | — | — | US | claimed |
| US-4176142-A | Powder coating composition | WESTERN ELECTRIC COMPANY, INC. (US) | 1979-11-27 | — | — | US | claimed |
| US-4140859-A | Dilithiated 2-(o-tolyl)-2-imidazolines | SANDOZ, INC. (US) | 1979-02-20 | — | — | US | claimed |
| CN-119998352-A | Epoxy resin curing agent, epoxy resin composition, sealing material, electrically conductive material, thermally conductive material, adhesive for camera module, adhesive for structure, matrix resin for fiber-reinforced plastic, impregnating and fixing material, interlayer insulating film, film-type solder resist, sealing sheet, electrically conductive film, anisotropic electrically conductive film, thermally conductive film, and method for producing dyed cured product | 旭化成株式会社 | 2025-05-13 | — | — | CN | disclosed |
| CN-112724596-B | Curable composition and cured product | 盛势达技研株式会社 | 2025-04-18 | — | — | CN | disclosed |
| WO-2025069598-A1 | EPOXY RESIN CURING AGENT, EPOXY RESIN COMPOSITION, SEALING MATERIAL, CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE MATERIAL, ADHESIVE FOR CAMERA MODULES, ADHESIVE FOR STRUCTURES, MATRIX RESIN FOR FIBER-REINFORCED PLASTICS, IMPREGNATED FIXING MATERIAL, INTERLAYER INSULATING FILM, FILM-TYPE SOLDER RESIST, SEALING SHEET, CONDUCTIVE FILM, ANISOTROPIC CONDUCTIVE FILM, THERMALLY CONDUCTIVE FILM, AND METHOD FOR PRODUCING DYED CURED PRODUCT | 旭化成株式会社 | 2025-04-03 | — | — | WO | disclosed |
| US-20240376291-A1 | EPOXY RESIN COMPOSITION, FILM, METHOD FOR PRODUCING FILM, AND CURED PRODUCTS | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2024-11-14 | — | — | US | disclosed |
| EP-4405429-A1 | THERMALLY CONDUCTIVE ADHESIVE COMPOSITION, PREPARATION METHOD AND USE THEREOF | Henkel AG & Co. KGaA (DE) | 2024-07-31 | — | — | EP | disclosed |
| US-20240240067-A1 | THERMALLY CONDUCTIVE ADHESIVE COMPOSITION, PREPARATION METHOD AND USE THEREOF | HENKEL AG & CO KGAA (DE) | 2024-07-18 | — | — | US | disclosed |
| CN-117980427-A | Thermally conductive adhesive composition, method for the production and use thereof | 汉高股份有限及两合公司 | 2024-05-03 | — | — | CN | disclosed |
| US-4140859-A | Dilithiated 2-(o-tolyl)-2-imidazolines | SANDOZ, INC. (US) | 1979-02-20 | — | — | US | disclosed |
| EP-0000418-A1 | Process for glueing materials | CHEMISCHE WERKE HÜLS AG (DE) | 1979-01-24 | — | — | EP | disclosed |
| EP-0000232-A1 | Process for the preparation of blocked polyisocyanates and blocked polyisocyanates obtainable therby | CHEMISCHE WERKE HÜLS AG (DE) | 1979-01-10 | — | — | EP | disclosed |
| US-4127562-A | HARDENER, VARNISH ADDITIVES, 1,2-EPOXY COMPOUNDS | VEBA-CHEMIE AKTIENGESELLSCHAFT (DE) | 1978-11-28 | — | — | US | disclosed |
| US-4101553-A | Imidazo[2,1-a]isoquinolines | SANDOZ, INC. (US) | 1978-07-18 | — | — | US | disclosed |
| US-4101553-A | Imidazo[2,1-a]isoquinolines | SANDOZ, INC. (US) | 1978-07-18 | — | — | US | disclosed |
| US-4100165-A | Imidazo [2,1-a]isoquinolines | SANDOZ, INC. (US) | 1978-07-11 | — | — | US | disclosed |
| US-4100165-A | Imidazo [2,1-a]isoquinolines | SANDOZ, INC. (US) | 1978-07-11 | — | — | US | disclosed |