⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4965509 | 0.86 | — | — | |
| SCHEMBL12865865 | 0.84 | ZDHHC7 (0.33) | — | |
| SCHEMBL129773 | 0.84 | ZDHHC7 (0.33) | — | |
| SCHEMBL11506744 | 0.82 | ZDHHC7 (0.36) | — | |
| SCHEMBL21891760 | 0.81 | — | — | |
| SCHEMBL1271467 | 0.81 | — | — | |
| SCHEMBL23794918 | 0.80 | CPB2 (0.33) | — | |
| SCHEMBL1173908 | 0.80 | CPB2 (0.33) | — | |
| SCHEMBL30943445 | 0.80 | CPB2 (0.33) | — | |
| SCHEMBL21891819 | 0.79 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4405429-A1 | THERMALLY CONDUCTIVE ADHESIVE COMPOSITION, PREPARATION METHOD AND USE THEREOF | Henkel AG & Co. KGaA (DE) | 2024-07-31 | — | — | EP | disclosed |
| US-20240240067-A1 | THERMALLY CONDUCTIVE ADHESIVE COMPOSITION, PREPARATION METHOD AND USE THEREOF | HENKEL AG & CO KGAA (DE) | 2024-07-18 | — | — | US | disclosed |
| CN-117980427-A | Thermally conductive adhesive composition, method for the production and use thereof | 汉高股份有限及两合公司 | 2024-05-03 | — | — | CN | disclosed |
| WO-2023044701-A1 | THERMALLY CONDUCTIVE ADHESIVE COMPOSITION, PREPARATION METHOD AND USE THEREOF | HENKEL AG & CO. KGAA (DE) | 2023-03-30 | — | — | WO | disclosed |
| US-7927514-B2 | Microcapsule-based hardener for epoxy resin, masterbatch-based hardener composition for epoxy resin, one-part epoxy resin composition, and processed good | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2011-04-19 | — | — | US | disclosed |
| US-7820772-B2 | comprises an amine adduct and a low-molecular amine compound 2-methylimidazole; bisphenol A type epoxy resin reacted with 2-methylimidazole as the amine adduct; excellent hardening property at low temperature, and storage stability at low and high temperature; adhesives; sealant | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2010-10-26 | — | — | US | disclosed |
| US-20090186962-A1 | Microcapsule-Based Hardener for Epoxy Resin, Masterbatch-Based Hardener Composition for Epoxy Resin, One-Part Epoxy Resin Composition, and Processed Good | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2009-07-23 | — | — | US | disclosed |
| EP-1980580-A1 | MICROCAPSULE TYPE HARDENER FOR EPOXY RESIN, MASTERBATCH TYPE HARDENER COMPOSITION FOR EPOXY RESIN, ONE-PACK TYPE EPOXY RESIN COMPOSITION, AND PROCESSED ARTICLE | Asahi Kasei Chemicals Corporation (JP) | 2008-10-15 | — | — | EP | disclosed |
| US-20070244268-A1 | Hardener for Epoxy Resin and Epoxy Resin Composition | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2007-10-18 | — | — | US | disclosed |
| EP-1731545-A1 | HARDENER FOR EPOXY RESIN AND EPOXY RESIN COMPOSITION | Asahi Kasei Chemicals Corporation (JP) | 2006-12-13 | — | — | EP | disclosed |
| US-20060128835-A1 | Capsule type hardener and composition | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2006-06-15 | — | — | US | disclosed |
| EP-1557438-A1 | CAPSULE TYPE HARDENER AND COMPOSITION | Asahi Kasei Chemicals Corporation (JP) | 2005-07-27 | — | — | EP | disclosed |