⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8639578 | 0.78 | ALDH1A1 (0.33) | — | |
| SCHEMBL7091302 | 0.72 | — | — | |
| SCHEMBL342085 | 0.69 | — | — | |
| SCHEMBL9068419 | 0.69 | — | — | |
| SCHEMBL9805300 | 0.67 | — | — | |
| SCHEMBL16969940 | 0.67 | — | — | |
| SCHEMBL11660125 | 0.67 | — | — | |
| SCHEMBL11863356 | 0.67 | — | — | |
| SCHEMBL4445120 | 0.67 | — | — | |
| SCHEMBL728389 | 0.65 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5132171-A | Coated with an adhesive containing thermally expansible graphite | SANWA KAKO COMPANY LIMITED (JP) | 1992-07-21 | — | — | US | claimed |
| JP-1205409-A | — | — | None | — | — | JP | disclosed |
| CN-104238270-B | Composition, method for forming pattern, crystal grain and method for manufacturing display device | 奇美实业股份有限公司 | 2018-11-09 | — | — | CN | disclosed |
| CN-104345557-B | Negative photosensitive resin composition, pattern, crystal grain and device manufacturing method | 奇美实业股份有限公司 | 2018-06-22 | — | — | CN | disclosed |
| US-20180024057-A1 | MEASUREMENT DEVICE | NITTO DENKO CORPORATION (JP) | 2018-01-25 | — | — | US | disclosed |
| CN-107544210-A | Negative photosensitive resin composition, method for producing spacer, method for producing protective film, and liquid crystal display element | 奇美实业股份有限公司 | 2018-01-05 | — | — | CN | disclosed |
| CN-107544208-A | Negative photosensitive resin composition, spacer, protective film and liquid crystal display element | 奇美实业股份有限公司 | 2018-01-05 | — | — | CN | disclosed |
| US-20180004086-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD OF SPACER, PRODUCTION METHOD OF PROTECTION FILM, AND LIQUID CRYSTAL DISPLAY DEVICE | CHI MEI CORPORATION (TW) | 2018-01-04 | — | — | US | disclosed |
| US-9535003-B2 | SPR sensor cell and SPR sensor | NITTO DENKO CORPORATION (JP) | 2017-01-03 | — | — | US | disclosed |
| US-9366959-B2 | Negative photosensitive resin composition and application thereof | CHI MEI CORPORATION (TW) | 2016-06-14 | — | — | US | disclosed |
| US-5895800-A | A HEAT RESISTANCE, SOLVENT RESISTANCE POLYNORBORNENE GRAFT COPOLYMER AND A CURING AGENT TO FORM A DIELECTRIC PROTECTIVE COATINGS FOR SEMICONDUCTOR, PRINTED CIRCUITS, ELECTRONICS | NIPPON ZEON CO., LTD. (JP) | 1999-04-20 | — | — | US | disclosed |
| US-5783639-A | CROSSLINKED THERMOPLASTIC NORBORNENE RESIN | NIPON ZEON CO., LTD. (JP) | 1998-07-21 | — | — | US | disclosed |
| US-5714277-A | MIXING FLAME RETARDANT MATERIAL INTO ELECTROLYTE | CANON KABUSHIKI KAISHA (JP) | 1998-02-03 | — | — | US | disclosed |
| EP-0814531-A2 | Secondary battery | CANON KABUSHIKI KAISHA (JP) | 1997-12-29 | — | — | EP | disclosed |
| US-5688628-A | ACID FORMER, POLYMERS, PHENOLIC COMPOUND | NIPPON ZEON CO., LTD. (JP) | 1997-11-18 | — | — | US | disclosed |
| EP-0786701-A1 | RESIST COMPOSITION | NIPPON ZEON CO., LTD. (JP) | 1997-07-30 | — | — | EP | disclosed |
| EP-0631339-A2 | Secondary battery | CANON KABUSHIKI KAISHA (JP) | 1994-12-28 | — | — | EP | disclosed |
| US-5132171-A | Coated with an adhesive containing thermally expansible graphite | SANWA KAKO COMPANY LIMITED (JP) | 1992-07-21 | — | — | US | disclosed |
| EP-0419147-A2 | Resist composition | NIPPON ZEON CO., LTD. (JP) | 1991-03-27 | — | — | EP | disclosed |
| JP-H01205409-A | MANUFACTURE OF LAMINATED CERAMIC CAPACITOR | NIPPON CHEMICON CORP | 1989-08-17 | — | — | JP | disclosed |