Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 9/20 | 0.59 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.59 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.59 |
| ▸ | HPGD | P15428 | 1/20 | 0.54 |
| ▸ | TP53 | P04637 | 3/20 | 0.42 |
| ▸ | HIF1A | Q16665 | 3/20 | 0.42 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.42 |
| ▸ | THRB | P10828 | 2/20 | 0.40 |
| ▸ | HCAR2 | Q8TDS4 | 3/20 | 0.38 |
| ▸ | ATM | Q13315 | 1/20 | 0.37 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.35 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.35 |
| ▸ | ACHE | P22303 | 4/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29737735 | 1.00 | TSHR (0.59) | TSHRALDH1A1CYP3A4HPGDTP53 | |
| SCHEMBL29737740 | 1.00 | TSHR (0.59) | TSHRALDH1A1CYP3A4HPGDTP53 | |
| SCHEMBL29737744 | 1.00 | TSHR (0.59) | TSHRALDH1A1CYP3A4HPGDTP53 | |
| SCHEMBL16537213 | 1.00 | TSHR (0.59) | TSHRALDH1A1CYP3A4HPGDTP53 | |
| SCHEMBL21402795 | 1.00 | TSHR (0.59) | TSHRALDH1A1CYP3A4HPGDTP53 | |
| SCHEMBL29737746 | 1.00 | TSHR (0.59) | TSHRALDH1A1CYP3A4HPGDTP53 | |
| SCHEMBL29737752 | 1.00 | TSHR (0.59) | TSHRALDH1A1CYP3A4HPGDTP53 | |
| SCHEMBL29737748 | 1.00 | TSHR (0.59) | TSHRALDH1A1CYP3A4HPGDTP53 | |
| SCHEMBL29737745 | 1.00 | TSHR (0.59) | TSHRALDH1A1CYP3A4HPGDTP53 | |
| SCHEMBL8154703 | 0.98 | TSHR (0.56) | TSHRALDH1A1CYP3A4HPGDTP53 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4563609-A1 | PHOTOCURABLE COMPOSITION, CURED PRODUCT OF SAME, AND COATED ARTICLE | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2025-06-04 | — | — | EP | disclosed |
| US-12319815-B2 | Resin composition, method for producing same, and multi-liquid curable resin composition | KANEKA CORPORATION (JP) | 2025-06-03 | — | — | US | disclosed |
| US-12312494-B2 | Resin composition, method for producing same, and multi-liquid curable resin composition | KANEKA CORPORATION (JP) | 2025-05-27 | — | — | US | disclosed |
| CN-119585328-A | Photocurable composition, cured product thereof, and coated article | 信越化学工业株式会社 | 2025-03-07 | — | — | CN | disclosed |
| US-20240174780-A1 | HOLLOW PARTICLES AND USE THEREOF | SEKISUI KASEI CO., LTD. (JP) | 2024-05-30 | — | — | US | disclosed |
| WO-2024024370-A1 | PHOTOCURABLE COMPOSITION, CURED PRODUCT OF SAME, AND COATED ARTICLE | 信越化学工業株式会社 | 2024-02-01 | — | — | WO | disclosed |
| US-11883790-B2 | Hollow particles, method for producing same, and usage of same | SEKISUI KASEI CO., LTD. (JP) | 2024-01-30 | — | — | US | disclosed |
| CN-115003759-B | Resin composition, method for producing same, and multicomponent curable resin composition | 株式会社钟化 | 2023-12-01 | — | — | CN | disclosed |
| CN-117015435-A | Hollow particles and uses thereof | 积水化成品工业株式会社 | 2023-11-07 | — | — | CN | disclosed |
| CN-116917368-A | Curable resin composition and use thereof | 株式会社钟化 | 2023-10-20 | — | — | CN | disclosed |
| US-20220288550-A1 | HOLLOW PARTICLES AND USE THEREOF | SEKISUI PLASTICS CO., LTD. (JP) | 2022-09-15 | — | — | US | disclosed |
| EP-4056639-A1 | ELASTOMER COMPOSITION AND TIRE | Sumitomo Rubber Industries, Ltd. (JP) | 2022-09-14 | — | — | EP | disclosed |
| CN-115003759-A | Resin composition, method for producing same, and multi-component curable resin composition | 株式会社钟化 | 2022-09-02 | — | — | CN | disclosed |
| US-11369935-B2 | Hollow particles and use thereof | SEKISUI PLASTICS CO., LTD. (JP) | 2022-06-28 | — | — | US | disclosed |
| CN-110651336-B | Conductive paste composition, electrode device comprising same, and method for producing conductive paste composition | 株式会社钟化 | 2022-05-17 | — | — | CN | disclosed |
| US-20220073747-A1 | RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MULTI-LIQUID CURABLE RESIN COMPOSITION | KANEKA CORPORATION (JP) | 2022-03-10 | — | — | US | disclosed |
| CN-104080815-B | Solidification compound and its purposes | SHOWA DENKO KABUSHIKI KAISHA (JP) | 2016-03-02 | — | — | CN | disclosed |
| US-9109072-B2 | Curable composition and uses thereof | SHOWA DENKO K.K. (JP) | 2015-08-18 | — | — | US | disclosed |
| US-20140378571-A1 | CURABLE COMPOSITION AND USES THEREOF | SHOWA DENKO K.K. (JP) | 2014-12-25 | — | — | US | disclosed |
| EP-2813521-A1 | CURABLE COMPOSITION AND APPLICATION THEREFOR | Showa Denko K.K. (JP) | 2014-12-17 | — | — | EP | disclosed |