SCHEMBL16318052

SCHEMBL16318052

COCc1c(O)c(C(C)O)c(C(C)O)c(O)c1COC

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
IGF1R P08069 1/20 0.36
SRC P12931 1/20 0.36
AXL P30530 1/20 0.36
PTK2 Q05397 1/20 0.36
AURKB Q96GD4 1/20 0.36
ALK Q9UM73 1/20 0.36
PRKCE Q02156 2/20 0.32
MYLK Q15746 2/20 0.32
ALDH1A1 P00352 2/20 0.32
MEN1 O00255 1/20 0.32
PRKCG P05129 1/20 0.32
MAPT P10636 1/20 0.32
PRKCA P17252 1/20 0.32
APEX1 P27695 1/20 0.32
RECQL P46063 1/20 0.32
KMT2A Q03164 1/20 0.32
TDP1 Q9NUW8 1/20 0.32
LMNA P02545 1/20 0.30
HPGD P15428 1/20 0.30
TSHR P16473 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16318102 0.82 IGF1R (0.39) IGF1RSRCAXLPTK2AURKB
SCHEMBL16850514 0.77 IGF1R (0.45) IGF1RSRCAXLPTK2AURKB
SCHEMBL2220146 0.72 IGF1R (0.47) IGF1RSRCAXLPTK2AURKB
SCHEMBL25446789 0.67 IGF1R (0.38) IGF1RSRCAXLPTK2AURKB
SCHEMBL16318038 0.66 HPGD (0.36) IGF1RSRCAXLPTK2AURKB
SCHEMBL19600595 0.65 IGF1R (0.37) IGF1RSRCAXLPTK2AURKB
SCHEMBL5527159 0.64 IGF1R (0.40) IGF1RSRCAXLPTK2AURKB
SCHEMBL16854080 0.64 IGF1R (0.48) IGF1RSRCAXLPTK2AURKB
SCHEMBL14271059 0.62 IGF1R (0.38) IGF1RSRCAXLPTK2AURKB
SCHEMBL2218610 0.61 PRKCE (0.47) IGF1RSRCAXLPTK2AURKB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20170327644-A1 RESIN AND PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2017-11-16 US disclosed
US-7615324-B2 Photosensitive composition, and cured relief pattern production method and semiconductor device using the same FUJIFILM CORPORATION (JP) 2009-11-10 US disclosed
US-7507518-B2 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2009-03-24 US disclosed
US-20080227024-A1 PHOTOSENSITIVE COMPOSITION, AND CURED RELIEF PATTERN PRODUCTION METHOD AND SEMICONDUCTOR DEVICE USING THE SAME FUJIFILM CORPORATION (JP) 2008-09-18 US disclosed